| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
J. Comput. Virol. Hacking Tech.
|
| 2024 | J | jnl |
Sensors
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2020 | — | conf |
Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB.
IEEE SENSORS
|
| 2017 | C | conf |
BSN
|
| 2005 | — | conf |
ReCoSoC
|
| 1999 | A | conf |
ICDAR
|
| 1998 | A | conf |
WACV
|
| 1997 | — | conf |
GREC
|
| 1995 | — | conf |
ICNN
|