| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2020 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans. Computers
|
| 2018 | A* | conf |
DAC
|
| 2017 | — | conf |
ANDARE@PACT
|
| 2017 | A* | conf |
DAC
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2015 | A | conf |
ICCAD
|
| 2015 | A | conf |
ICCAD
|
| 2014 | A | conf |
DATE
|
| 2014 | A | conf |
Ambient variation-tolerant and inter components aware thermal management for mobile system on chips.
DATE
|
| 2014 | C | conf |
EUC
|
| 2014 | C | conf |
ICCD
|
| 2013 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2013 | A | conf |
DATE
|
| 2013 | A* | conf |
DAC
|
| 2012 | J | jnl |
IEEE Trans. Computers
|
| 2012 | — | — |
|
| 2012 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2011 | A | conf |
DATE
|
| 2011 | — | conf |
SoC
|
| 2010 | — | conf |
Conf. Computing Frontiers
|
| 2009 | A | conf |
DATE
|
| 2009 | — | conf |
ESTIMedia
|