| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2026 | J | jnl |
IEEE Trans. Netw. Sci. Eng.
|
| 2026 | J | jnl |
IEEE J. Biomed. Health Informatics
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
IEEE Commun. Mag.
|
| 2025 | B | conf |
ICCCN
|
| 2025 | J | jnl |
IEEE Signal Process. Lett.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
Int. J. Hum. Comput. Interact.
|
| 2025 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2025 | J | jnl |
IEEE Internet Things Mag.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Comput. Methods Programs Biomed.
|
| 2025 | B | conf |
ICCCN
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Eng. Comput.
|
| 2024 | — | conf |
WCSP
|
| 2024 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2024 | — | conf |
WCSP
|
| 2024 | J | jnl |
IEEE J. Biomed. Health Informatics
|
| 2024 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2024 | — | conf |
VTC Spring
|
| 2024 | J | jnl |
CoRR
|
| 2024 | B | conf |
WCNC
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | — | conf |
MeMeA
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2023 | — | conf |
ICIEAI
|
| 2023 | B | conf |
GLOBECOM
|
| 2023 | B | conf |
PIMRC
|
| 2023 | — | conf |
VTC Fall
|
| 2023 | — | conf |
VTC2023-Spring
|
| 2023 | J | jnl |
J. Frankl. Inst.
|
| 2023 | — | conf |
ICC Workshops
|
| 2023 | J | jnl |
Inverse-GMM: A Latency Distribution Shaping Method for Industrial Cooperative Deep Learning Systems.
IEEE J. Sel. Areas Commun.
|
| 2023 | — | conf |
ICAC
|
| 2022 | — | conf |
NAS
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
WCSP
|
| 2022 | J | jnl |
Briefings Bioinform.
|
| 2022 | J | jnl |
J. Database Manag.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | — | conf |
ICC Workshops
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Bioinform.
|
| 2022 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2022 | — | conf |
ISCSIC
|
| 2022 | J | jnl |
IEEE Internet Things J.
|
| 2022 | C | conf |
APCC
|
| 2021 | C | conf |
IGARSS
|
| 2021 | — | conf |
GLOBECOM (Workshops)
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Sensors
|
| 2021 | J | jnl |
Bioinform.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Comput. Stat.
|
| 2021 | J | jnl |
Briefings Bioinform.
|
| 2021 | — | conf |
WCNC Workshops
|
| 2020 | C | conf |
IGARSS
|
| 2020 | J | jnl |
Enabling Capacity Estimation With Ergodic Interference Power in Cellular-Based Multiple UAV Systems.
IEEE Access
|
| 2020 | J | jnl |
IET Commun.
|
| 2020 | — | conf |
ICTA
|
| 2019 | — | conf |
SoCC
|
| 2019 | — | conf |
CSAI
|
| 2019 | — | conf |
ICSAI
|
| 2019 | — | conf |
WCSP
|
| 2019 | — | conf |
ADHOCNETS
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Commun. Mag.
|
| 2019 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2019 | — | conf |
ICBBE
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | A* | conf |
INFOCOM
|
| 2019 | — | conf |
NLPCC (2)
|
| 2019 | J | jnl |
IEEE Internet Things J.
|
| 2019 | J | jnl |
Evol. Intell.
|
| 2019 | — | conf |
VTC Fall
|
| 2018 | J | jnl |
Comput. Chem. Eng.
|
| 2018 | — | conf |
WCSP
|
| 2018 | — | conf |
GlobalSIP
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2018 | — | conf |
ECCV (2)
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface.
Microelectron. Reliab.
|
| 2018 | — | conf |
WCSP
|
| 2017 | Misc | conf |
ICASSP
|
| 2017 | J | jnl |
IEEE Trans. Image Process.
|
| 2017 | J | jnl |
IEEE Trans. Engineering Management
|
| 2017 | B | conf |
ICIP
|
| 2016 | C | conf |
CIS
|
| 2016 | C | conf |
CIS
|
| 2016 | J | jnl |
CoRR
|
| 2016 | J | jnl |
Microelectron. Reliab.
|
| 2016 | J | jnl |
Eur. J. Oper. Res.
|
| 2016 | J | jnl |
IEEE Wirel. Commun.
|
| 2015 | C | conf |
CIS
|
| 2015 | C | conf |
INDIN
|
| 2015 | — | conf |
ICC
|
| 2014 | J | jnl |
J. Comput. Sci.
|
| 2014 | J | jnl |
IET Wirel. Sens. Syst.
|
| 2014 | J | jnl |
Int. J. Distributed Sens. Networks
|
| 2014 | J | jnl |
Microelectron. Reliab.
|
| 2014 | J | jnl |
IEEE Commun. Lett.
|
| 2014 | J | jnl |
IEEE Wirel. Commun.
|
| 2014 | J | jnl |
Decis. Sci.
|
| 2013 | J | jnl |
ACM Trans. Sens. Networks
|
| 2013 | J | jnl |
Ad Hoc Networks
|
| 2013 | — | conf |
VTC Spring
|
| 2012 | J | jnl |
Eur. J. Oper. Res.
|
| 2011 | B | conf |
LCN
|
| 2011 | J | jnl |
Microelectron. Reliab.
|
| 2010 | J | jnl |
IEEE J. Sel. Areas Commun.
|
| 2009 | B | conf |
WiOpt
|
| 2009 | — | conf |
MOBIWAC
|