Eric Woirgard

35 papers Journal 34Unranked 1
YearRankTypeTitle / Venue / Authors
2018 J jnl
Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses.
Microelectron. Reliab.
Omar Chihani, L. Théolier, Alain Bensoussan, Jean-Yves Delétage, André Durier, Eric Woirgard
2018 — conf
Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs.
IRPS
Omar Chihani, Loic Théolier, Jean-Yves Delétage, Eric Woirgard, Alain Bensoussan, André Durier
2017 J jnl
Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering.
Microelectron. Reliab.
Maxime Barrière, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, François Le Henaff
2016 J jnl
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices.
Microelectron. Reliab.
Faical Arabi, Loic Théolier, Donatien Martineau, Jean-Yves Delétage, M. Medina, Eric Woirgard
2015 J jnl
Ageing mechanisms in Deep Trench Termination (DT
Microelectron. Reliab.
F. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, Eric Woirgard
2015 J jnl
Identification and analysis of power substrates degradations subjected to severe aging tests.
Microelectron. Reliab.
Eric Woirgard, Faical Arabi, Wissam Sabbah, Donatien Martineau, L. Théolier, Stephane Azzopardi
2015 J jnl
Mechanical stress investigation after technological process in Deep Trench Termination DT
Microelectron. Reliab.
Houssam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard
2015 J jnl
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity.
Microelectron. Reliab.
Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard
2013 J jnl
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach.
Microelectron. Reliab.
F. Baccar, Stephane Azzopardi, L. Théolier, K. El Boubkari, Jean-Yves Delétage, Eric Woirgard
2013 J jnl
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy.
Microelectron. Reliab.
Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard
2012 J jnl
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization.
Microelectron. Reliab.
François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet
2012 J jnl
Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications.
Microelectron. Reliab.
Akram Eddahech, Olivier Briat, Eric Woirgard, Jean-Michel Vinassa
2011 J jnl
Ageing monitoring of lithium-ion cell during power cycling tests.
Microelectron. Reliab.
Akram Eddahech, Olivier Briat, Hervé Henry, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa
2011 J jnl
How supercapacitors reach end of life criteria during calendar life and power cycling tests.
Microelectron. Reliab.
Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa
2010 J jnl
Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling.
Microelectron. Reliab.
Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, H. El Brouji, Jean-Yves Delétage, Eric Woirgard
2010 J jnl
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature.
Microelectron. Reliab.
Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard
2009 J jnl
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications.
Microelectron. Reliab.
Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama
2009 J jnl
Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions.
Microelectron. Reliab.
H. El Brouji, Olivier Briat, Jean-Michel Vinassa, Hervé Henry, Eric Woirgard
2009 J jnl
Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance.
IEEE Trans. Veh. Technol.
E.-Hassane El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard
2009 J jnl
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation.
Microelectron. Reliab.
Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard
2008 J jnl
Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests.
Microelectron. Reliab.
H. El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard
2007 J jnl
A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation.
Microelectron. Reliab.
Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard
2007 J jnl
Monitoring fading rate of ultracapacitors using online characterization during power cycling.
Microelectron. Reliab.
Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, H. El Brouji, Eric Woirgard
2007 J jnl
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions.
Microelectron. Reliab.
Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard
2006 J jnl
Failure mechanism of trench IGBT under short-circuit after turn-off.
Microelectron. Reliab.
Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard
2006 J jnl
Power cycling tests for accelerated ageing of ultracapacitors.
Microelectron. Reliab.
Olivier Briat, Walid Lajnef, Jean-Michel Vinassa, Eric Woirgard
2005 J jnl
Assessment of the Trench IGBT reliability: low temperature experimental characterization.
Microelectron. Reliab.
Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard
2005 J jnl
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability.
Microelectron. Reliab.
Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini
2005 J jnl
Specification and use of pulsed current profiles for ultracapacitors power cycling.
Microelectron. Reliab.
Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard
2004 J jnl
Influence of the thermo-mechanical residual state on the power assembly modellization.
Microelectron. Reliab.
Alexandrine Guédon-Gracia, Pascal Roux, Eric Woirgard, Christian Zardini
2003 J jnl
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?
Microelectron. Reliab.
Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat, Christian Zardini
2003 J jnl
Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant.
Microelectron. Reliab.
Alexandrine Guédon, Eric Woirgard, Christian Zardini, Guillaume Simon
2002 J jnl
Evaluation of lead-free soldering for automotive applications.
Microelectron. Reliab.
Alexandrine Guédon, Eric Woirgard, Christian Zardini
2002 J jnl
Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations.
Microelectron. Reliab.
P. Guilbault, Eric Woirgard, Christian Zardini, D. Lambert
2001 J jnl
Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs.
Microelectron. Reliab.
Stephane Azzopardi, Atsuo Kawamura, Hideo Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini