Eren Kursun - RankMe

38 papers A* 4A 4B 1C 6Journal 17Unranked 6

Year	Rank	Type	Title / Venue / Authors
2021	J	`jnl`	Label Augmentation via Time-based Knowledge Distillation for Financial Anomaly Detection. CoRR Hongda Shen, Eren Kursun
2017	—	`conf`	Compact and voltage-scalable sensor for accurate thermal sensing in dynamic thermal management. MWSCAS Teng Yang, Pavan Kumar Chundi, Seongjong Kim, Eren Kursun, Martha A. Kim, Peter R. Kinget, Mingoo Seok
2017	J	`jnl`	Editorial. IEEE Trans. Very Large Scale Integr. Syst. Krishnendu Chakrabarty, Massimo Alioto, Bevan M. Baas, Chirn Chye Boon, Meng-Fan Chang, Naehyuck Chang, Yao-Wen Chang, Chip-Hong Chang, Shih-Chieh Chang, Poki Chen, Masud H. Chowdhury, Pasquale Corsonello, Ibrahim Abe M. Elfadel, Said Hamdioui, Masanori Hashimoto, Tsung-Yi Ho, Houman Homayoun, Yuh-Shyan Hwang, Rajiv V. Joshi, Tanay Karnik, Mehran Mozaffari Kermani, Chulwoo Kim, Tae-Hyoung Kim, Jaydeep P. Kulkarni, Eren Kursun, Erik Larsson, Hai (Helen) Li, Huawei Li, Patrick P. Mercier, Prabhat Mishra, Makoto Nagata, Arun S. Natarajan, Koji Nii, Partha Pratim Pande, Ioannis Savidis, Mingoo Seok, Sheldon X.-D. Tan, Mark Tehranipoor, Aida Todri-Sanial, Miroslav N. Velev, Xiaoqing Wen, Jiang Xu, Wei Zhang, Zhengya Zhang, Stacey Weber Jackson
2017	A	`conf`	Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors. ISLPED Pavan Kumar Chundi, Yini Zhou, Martha A. Kim, Eren Kursun, Mingoo Seok
2017	—	`conf`	Security Threats and Countermeasures in Three-Dimensional Integrated Circuits. ACM Great Lakes Symposium on VLSI Jaya Dofe, Peng Gu, Dylan C. Stow, Qiaoyan Yu, Eren Kursun, Yuan Xie
2017	J	`jnl`	Thermomechanical Stress-Aware Management for 3-D IC Designs. IEEE Trans. Very Large Scale Integr. Syst. Qiaosha Zou, Eren Kursun, Yuan Xie
2016	—	`conf`	Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges. ACM Great Lakes Symposium on VLSI Peng Gu, Shuangchen Li, Dylan C. Stow, Russell Barnes, Liu Liu, Yuan Xie, Eren Kursun
2016	C	`conf`	Thermal-aware 3D design for side-channel information leakage. ICCD Peng Gu, Dylan C. Stow, Russell Barnes, Eren Kursun, Yuan Xie
2014	A*	`conf`	3D stacking of high-performance processors. HPCA Philip G. Emma, Alper Buyuktosunoglu, Michael B. Healy, Krishnan Kailas, Valentin Puente, Roy Yu, Allan Hartstein, Pradip Bose, Jaime H. Moreno, Eren Kursun
2013	J	`jnl`	Exploring the vulnerability of CMPs to soft errors with 3D stacked nonvolatile memory. ACM J. Emerg. Technol. Comput. Syst. Guangyu Sun, Eren Kursun, Jude A. Rivers, Yuan Xie
2013	A	`conf`	Thermomechanical stress-aware management for 3D IC designs. DATE Qiaosha Zou, Tao Zhang, Eren Kursun, Yuan Xie
2013	J	`jnl`	Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie
2012	A*	`conf`	An information-theoretic framework for optimal temperature sensor allocation and full-chip thermal monitoring. DAC Huapeng Zhou, Xin Li, Chen-Yong Cher, Eren Kursun, Haifeng Qian, Shi-Chune Yao
2012	J	`jnl`	Fast poisson solvers for thermal analysis. ACM Trans. Design Autom. Electr. Syst. Haifeng Qian, Sachin S. Sapatnekar, Eren Kursun
2012	J	`jnl`	Spatial and temporal thermal characterization of stacked multicore architectures. ACM J. Emerg. Technol. Comput. Syst. Eren Kursun, Jamil A. Wakil, Mukta Farooq, Robert Hannon
2011	A	`conf`	Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs. ISLPED Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie
2011	J	`jnl`	Characterizing Power and Temperature Behavior of POWER6-Based System. IEEE J. Emerg. Sel. Topics Circuits Syst. Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Mateo Valero, Carlos Boneti, Eren Kursun, Chen-Yong Cher, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose
2011	A*	`conf`	Design, CAD and technology challenges for future processors: 3D perspectives. DAC Jeff Burns, Gary Carpenter, Eren Kursun, Ruchir Puri, James D. Warnock, Michael Scheuermann
2011	J	`jnl`	Energy-Aware Accounting and Billing in Large-Scale Computing Facilities. IEEE Micro Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Eren Kursun, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose, Mateo Valero
2011	J	`jnl`	Exploring the effects of on-chip thermal variation on high-performance multicore architectures. ACM Trans. Archit. Code Optim. Chen-Yong Cher, Eren Kursun
2011	C	`conf`	Exploring the vulnerability of CMPs to soft errors with 3D stacked non-volatile memory. ICCD Guangyu Sun, Eren Kursun, Jude A. Rivers, Yuan Xie
2010	B	`conf`	Power and thermal characterization of POWER6 system. PACT Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Mateo Valero, Carlos Boneti, Eren Kursun, Chen-Yong Cher, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose
2010	—	`conf`	Power-efficient, reliable microprocessor architectures: modeling and design methods. ACM Great Lakes Symposium on VLSI Pradip Bose, Alper Buyuktosunoglu, Chen-Yong Cher, John A. Darringer, Meeta Sharma Gupta, Hendrik F. Hamann, Hans M. Jacobson, Prabhakar Kudva, Eren Kursun, Niti Madan, Indira Nair, Jude A. Rivers, Jeonghee Shin, Alan J. Weger, Victor V. Zyuban
2010	C	`conf`	Trends and techniques for energy efficient architectures. VLSI-SoC Víctor Jiménez, Roberto Gioiosa, Eren Kursun, Francisco J. Cazorla, Chen-Yong Cher, Alper Buyuktosunoglu, Pradip Bose, Mateo Valero
2009	J	`jnl`	Opportunities and Challenges for 3D Systems and Their Design. IEEE Des. Test Comput. Philip G. Emma, Eren Kursun
2009	J	`jnl`	Temperature Variation Characterization and Thermal Management of Multicore Architectures. IEEE Micro Eren Kursun, Chen-Yong Cher
2008	J	`jnl`	Investigating the effects of fine-grain three-dimensional integration on microarchitecture design. ACM J. Emerg. Technol. Comput. Syst. Yuchun Ma, Yongxiang Liu, Eren Kursun, Glenn Reinman, Jason Cong
2008	J	`jnl`	Is 3D chip technology the next growth engine for performance improvement? IBM J. Res. Dev. Philip G. Emma, Eren Kursun
2008	C	`conf`	Variation-aware thermal characterization and management of multi-core architectures. ICCD Eren Kursun, Chen-Yong Cher
2007	C	`conf`	Fine grain 3D integration for microarchitecture design through cube packing exploration. ICCD Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinman, Jason Cong
2006	J	`jnl`	An Evaluation of Deeply Decoupled Cores. J. Instr. Level Parallelism Eren Kursun, Anahita Shayesteh, Suleyman Sair, Timothy Sherwood, Glenn Reinman
2005	J	`jnl`	Early Quality Assessment for Low Power Behavioral Synthesis. J. Low Power Electron. Eren Kursun, Rajarshi Mukherjee, Seda Ogrenci Memik
2005	C	`conf`	Reducing the Latency and Area Cost of Core Swapping through Shared Helper Engines. ICCD Anahita Shayesteh, Eren Kursun, Timothy Sherwood, Suleyman Sair, Glenn Reinman
2004	—	`conf`	Low-Overhead Core Swapping for Thermal Management. PACS Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita Shayesteh, Timothy Sherwood
2004	—	`conf`	Transistor Level Budgeting for Power Optimization. ISQED Eren Kursun, Soheil Ghiasi, Majid Sarrafzadeh
2003	A*	`conf`	Global resource sharing for synthesis of control data flow graphs on FPGAs. DAC Seda Ogrenci Memik, Gokhan Memik, Roozbeh Jafari, Eren Kursun
2002	A	`conf`	Early evaluation techniques for low power binding. ISLPED Eren Kursun, Ankur Srivastava, Seda Ogrenci Memik, Majid Sarrafzadeh
2002	J	`jnl`	Predictability in RT-Level Designs. J. Circuits Syst. Comput. Ankur Srivastava, Eren Kursun, Majid Sarrafzadeh