Eero Ristolainen

12 papers Journal 12
YearRankTypeTitle / Venue / Authors
2006 J jnl
Balancing temperature dependence of on-wafer SOS inductors.
Microelectron. Reliab.
Päivi H. Karjalainen, Eero Ristolainen
2005 J jnl
Flip chip attachment on flexible LCP substrate using an ACF.
Microelectron. Reliab.
Laura Frisk, Eero Ristolainen
2004 J jnl
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates.
Microelectron. Reliab.
Laura Frisk, Anne Seppälä, Eero Ristolainen
2004 J jnl
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints.
Microelectron. Reliab.
Anne Seppälä, Eero Ristolainen
2004 J jnl
The effect of solder paste composition on the reliability of SnAgCu joints.
Microelectron. Reliab.
S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö
2003 J jnl
Evaluation Of Resonating Channel Transistor In SOI Wafer.
Int. J. Comput. Eng. Sci.
S. Myllymaki, Eero Ristolainen, Pekka Heino, A. Lehto, K. Varjonen
2003 J jnl
Strength of Ta-Si interfaces by molecular dynamics.
Microelectron. Reliab.
Pekka Heino, Eero Ristolainen
2003 J jnl
Thermal conduction at the nanoscale in some metals by MD.
Microelectron. J.
Pekka Heino, Eero Ristolainen
2002 J jnl
Anisotropic conductive film flip chip joining using thin chips.
Microelectron. Reliab.
Erja Jokinen, Eero Ristolainen
2002 J jnl
Failure mechanisms of adhesive flip chip joints.
Microelectron. Reliab.
Anne Seppälä, T. Allinniemi, Eero Ristolainen
2002 J jnl
Impact of component placement in solder joint reliability.
Microelectron. Reliab.
T. Alander, S. Nurmi, Pekka Heino, Eero Ristolainen
2001 J jnl
Reliability of 80 mum pitch flip chip attachment on flex.
Microelectron. Reliab.
Petteri Palm, Jarmo Määttänen, Aulis Tuominen, Eero Ristolainen