Ee-Hua Wong

14 papers Journal 14
YearRankTypeTitle / Venue / Authors
2017 J jnl
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions.
Microelectron. Reliab.
Ee-Hua Wong, Johan Liu
2016 J jnl
Constitutive modeling of solder alloys for drop-impact applications.
Microelectron. Reliab.
Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah
2016 J jnl
Creep fatigue models of solder joints: A critical review.
Microelectron. Reliab.
Ee-Hua Wong, W. D. van Driel, Abhijit Dasgupta, Michael G. Pecht
2016 J jnl
Moisture diffusion modeling - A critical review.
Microelectron. Reliab.
Ee-Hua Wong, S. B. Park
2015 J jnl
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption.
Microelectron. Reliab.
Ee-Hua Wong, Jarrod Cook, M. Dreno, Dao-Long Chen, Yi-Shao Lai
2015 J jnl
The fundamentals of thermal-mass diffusion analogy.
Microelectron. Reliab.
Ee-Hua Wong
2009 J jnl
Advances in the drop-impact reliability of solder joints for mobile applications.
Microelectron. Reliab.
Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai
2009 J jnl
The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation.
Microelectron. Reliab.
Ee-Hua Wong, Yiu-Wing Mai
2008 J jnl
A review of board level solder joints for mobile applications.
Microelectron. Reliab.
Ee-Hua Wong, S. K. W. Seah, V. P. W. Shim
2008 J jnl
Correlation studies for component level ball impact shear test and board level drop test.
Microelectron. Reliab.
Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh
2006 J jnl
New insights into board level drop impact.
Microelectron. Reliab.
Ee-Hua Wong, Yiu-Wing Mai
2005 J jnl
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.
Microelectron. Reliab.
Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao
2004 J jnl
Thermo-mechanical finite element analysis in a multichip build up substrate based package design.
Microelectron. Reliab.
Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
2003 J jnl
Moisture absorption and diffusion characterisation of packaging materials--advanced treatment.
Microelectron. Reliab.
Ee-Hua Wong, Ranjan Rajoo