| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2025 | C | conf |
ISCAS
|
| 2025 | C | conf |
ISCAS
|
| 2024 | — | conf |
NewCAS
|
| 2024 | — | conf |
MILCOM
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2022 | — | conf |
MWSCAS
|
| 2022 | J | jnl |
Wirel. Networks
|
| 2022 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2022 | J | jnl |
IEEE Open J. Commun. Soc.
|
| 2021 | C | conf |
ISCAS
|
| 2021 | C | conf |
ISCAS
|
| 2020 | — | conf |
PLANS
|
| 2020 | J | jnl |
IEEE Commun. Lett.
|
| 2020 | — | conf |
TALE
|
| 2019 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2019 | J | jnl |
IET Comput. Digit. Tech.
|
| 2019 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2018 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2018 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2018 | J | jnl |
ACM Trans. Reconfigurable Technol. Syst.
|
| 2018 | Misc | conf |
FCCM
|
| 2018 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2018 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2018 | J | jnl |
Microprocess. Microsystems
|
| 2017 | — | conf |
TALE
|
| 2017 | B | conf |
FPL
|
| 2017 | Misc | conf |
FCCM
|
| 2017 | — | conf |
DFT
|
| 2017 | Misc | conf |
FCCM
|
| 2017 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2016 | — | conf |
FPT
|
| 2016 | Misc | conf |
FCCM
|
| 2015 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2015 | C | conf |
ISCAS
|
| 2014 | C | conf |
ISCAS
|
| 2013 | B | conf |
FPL
|
| 2009 | — | conf |
ECCTD
|
| 2008 | — | conf |
ACSCC
|