Dylan C. Stow

15 papers A* 1A 2C 1Journal 5Unranked 6
YearRankTypeTitle / Venue / Authors
2025 J jnl
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges.
CoRR
Peng Gu, Shuangchen Li, Dylan C. Stow, Russell Barnes, Liu Liu, Yuan Xie, Eren Kursshan
2025 J jnl
Thermal-Aware 3D Design for Side-Channel Information Leakage.
CoRR
Dylan C. Stow, Russell Barnes, Eren Kurshan, Yuan Xie
2019 A* conf
Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory.
DAC
Dylan C. Stow, Itir Akgun, Wenqin Huangfu, Yuan Xie, Xueqi Li, Gabriel H. Loh
2019 — conf
Investigation of Cost-Optimal Network-on-Chip for Passive and Active Interposer Systems.
SLIP
Dylan C. Stow, Itir Akgun, Yuan Xie
2019 J jnl
Network-on-Chip Design Guidelines for Monolithic 3-D Integration.
IEEE Micro
Itir Akgun, Dylan C. Stow, Yuan Xie
2019 J jnl
Power Profiling of Modern Die-Stacked Memory.
IEEE Comput. Archit. Lett.
Dylan C. Stow, Amin Farmahini Farahani, Sudhanva Gurumurthi, Michael Ignatowski, Yuan Xie
2018 — conf
Cost-efficient 3D Integration to Hinder Reverse Engineering During and After Manufacturing.
AsianHOST
Peng Gu, Dylan C. Stow, Prashansa Mukim, Shuangchen Li, Yuan Xie
2018 J jnl
Die Stacking Is Happening.
IEEE Micro
Xing Hu, Dylan C. Stow, Yuan Xie
2017 A conf
Cost-effective design of scalable high-performance systems using active and passive interposers.
ICCAD
Dylan C. Stow, Yuan Xie, Taniya Siddiqua, Gabriel H. Loh
2017 — conf
Security Threats and Countermeasures in Three-Dimensional Integrated Circuits.
ACM Great Lakes Symposium on VLSI
Jaya Dofe, Peng Gu, Dylan C. Stow, Qiaoyan Yu, Eren Kursun, Yuan Xie
2016 A conf
Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5D/3D integration.
ICCAD
Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie
2016 — conf
Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space.
ISVLSI
Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie
2016 — conf
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges.
ACM Great Lakes Symposium on VLSI
Peng Gu, Shuangchen Li, Dylan C. Stow, Russell Barnes, Liu Liu, Yuan Xie, Eren Kursun
2016 C conf
Thermal-aware 3D design for side-channel information leakage.
ICCD
Peng Gu, Dylan C. Stow, Russell Barnes, Eren Kursun, Yuan Xie
2012 — conf
Yield-driven minimum energy CMOS cell design.
ACSCC
Max A. Korbel, Dylan C. Stow, Chris R. Ferguson, David Money Harris