Donghyun Han

23 papers C 1Journal 13Unranked 9
YearRankTypeTitle / Venue / Authors
2026 J jnl
A Dual-Mode Online BISR Architecture for Interconnect and Memory Repair in Chiplet-Based Systems.
IEEE Trans. Reliab.
Donghyun Han, Sooryeong Lee, Jongho Park, Dayoung Kim, Seungtae Kim, Youngkwang Lee, Sungho Kang
2026 J jnl
Test Cycle Reduction for TSV Test Using Streaming Scan Network on 3-D IC.
IEEE Trans. Very Large Scale Integr. Syst.
Sunghoon Kim, Donghyun Han, Dayoung Kim, Sungho Kang
2025 J jnl
Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults.
IEEE Access
Seokjun Jang, Donghyun Han, Sunghoon Kim, Dayoung Kim, Sungho Kang
2025 J jnl
SPOT: Fast and Optimal Built-In Redundancy Analysis Using Smart Potential Case Collection.
IEEE Trans. Very Large Scale Integr. Syst.
Donghyun Han, Sunghoon Kim, Dayoung Kim, Sungho Kang
2025 J jnl
Shadow feature refinement network: progressive feature refinement based on knowledge distillation for effective shadow removal.
Multim. Syst.
Donghyun Han, Byoung-Dai Lee
2025 J jnl
TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM.
IEEE Trans. Reliab.
Donghyun Han, Duyeon Won, Sunghoon Kim, Sungho Kang
2024 — conf
Signal Shifting-based Reusable Redundant TSV Structure for Infrastructure TSV.
ISOCC
Donghyun Han, Sunghoon Kim, Sungho Kang
2023 — conf
LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture.
ISOCC
Sunghoon Kim, Donghyun Han, Seokjun Jang, Sungho Kang
2023 J jnl
Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
2023 J jnl
TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM.
IEEE Trans. Very Large Scale Integr. Syst.
Youngkwang Lee, Donghyun Han, Sungho Kang
2022 J jnl
Herringbone-Based TSV Architecture for Clustered Fault Repair and Aging Recovery.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sangmin Park, Minho Cheong, Donghyun Han, Sungho Kang
2022 J jnl
Multibank Optimized Redundancy Analysis Using Efficient Fault Collection.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Hogyeong Kim, Hayoung Lee, Donghyun Han, Sungho Kang
2021 — conf
A Circular-based TSV Repair Architecture.
ISOCC
Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang
2021 — conf
Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure.
ISOCC
Youngki Moon, Hyunho Yoo, Donghyun Han, Sungho Kang
2021 J jnl
ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory.
IEEE Access
Donghyun Han, Hayoung Lee, Seungtaek Lee, Sungho Kang
2021 J jnl
Effective Spare Line Allocation Built-in Redundancy Analysis With Base Common Spare for Yield Improvement of 3D Memory.
IEEE Access
Donghyun Han, Hayoung Lee, Sungho Kang
2021 — conf
Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC.
ISOCC
Donghyun Han, Youngkwang Lee, Sooryeong Lee, Sungho Kang
2020 — conf
Redundancy Analysis Optimization with Clustered Known Solutions for High Speed Repair.
ISOCC
Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang
2020 — conf
W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction.
ITC-Asia
Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang
2019 J jnl
Dynamic Built-In Redundancy Analysis for Memory Repair.
IEEE Trans. Very Large Scale Integr. Syst.
Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang
2019 — conf
Redundancy Analysis based on Fault Distribution for Memory with Complex Spares.
ISOCC
Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang
2018 C conf
3D Memory Formed of Unrepairable Memory Dice and Spare Layer.
TENCON
Donghyun Han, Hayoung Lee, Seungtaek Lee, Minho Moon, Sungho Kang
2017 — conf
A new repair scheme for TSV-based 3D memory using base die repair cells.
ISOCC
Donghyun Han, Hayoung Lee, Donghyun Kim, Sungho Kang