| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Computers
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ITSC
|
| 2025 | J | jnl |
IEEE Trans. Sustain. Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Vis. Comput. Graph.
|
| 2023 | A | conf |
MobiSys
|
| 2023 | J | jnl |
IEEE Trans. Vis. Comput. Graph.
|
| 2023 | J | jnl |
Manag. Sci.
|
| 2022 | J | jnl |
IEEE Des. Test
|
| 2022 | B | conf |
IEEE Big Data
|
| 2022 | J | jnl |
CoRR
|
| 2021 | A | conf |
ISLPED
|
| 2020 | B | conf |
ICCCI
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Comput. Graph. Forum
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | A* | conf |
IJCAI
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | — | conf |
NVMSA
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
CoRR
|
| 2017 | A | conf |
ISLPED
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2015 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2015 | — | conf |
VLSI-SoC (Selected Papers)
|
| 2015 | C | conf |
VLSI-SoC
|
| 2015 | A | conf |
ISLPED
|
| 2015 | C | conf |
VLSI-SoC
|
| 2015 | C | conf |
VLSI-SoC
|
| 2015 | A | conf |
ISLPED
|
| 2015 | J | jnl |
BMC Bioinform.
|
| 2014 | A | conf |
ISLPED
|
| 2014 | C | conf |
ICCD
|
| 2014 | A | conf |
DATE
|
| 2014 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2014 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2014 | A* | conf |
DAC
|
| 2014 | A | conf |
DATE
|
| 2013 | — | conf |
PATMOS
|
| 2013 | A | conf |
ISLPED
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | A | conf |
DATE
|
| 2013 | A | conf |
ISLPED
|
| 2013 | A | conf |
ICCAD
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | A | conf |
ICCAD
|
| 2013 | — | conf |
ASP-DAC
|
| 2013 | A | conf |
DATE
|
| 2012 | A | conf |
ICCAD
|
| 2012 | — | conf |
ASP-DAC
|
| 2012 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2012 | A* | conf |
DAC
|
| 2012 | A | conf |
ISLPED
|
| 2012 | A | conf |
DATE
|
| 2011 | A | conf |
DATE
|
| 2011 | A* | conf |
DAC
|
| 2010 | A | conf |
ISLPED
|
| 2010 | A | conf |
Dynamic thermal management for networked embedded systems under harsh ambient temperature variation.
ISLPED
|
| 2010 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2010 | — | conf |
ASP-DAC
|
| 2009 | A | conf |
ICCAD
|
| 2008 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2007 | A* | conf |
DAC
|