| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
LASCAS
|
| 2026 | — | conf |
LASCAS
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
MIXDES
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
LASCAS
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | — | conf |
EUROCON
|
| 2023 | — | conf |
ICECS
|
| 2023 | — | conf |
ESSDERC
|
| 2023 | J | jnl |
Sensors
|
| 2023 | — | conf |
ESSDERC
|
| 2023 | — | conf |
ESSDERC
|
| 2023 | J | jnl |
Sensors
|
| 2022 | — | conf |
ESSCIRC
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
JC&S
|
| 2022 | J | jnl |
Sensors
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
Sensors
|
| 2021 | — | conf |
IEEE SENSORS
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | — | conf |
IEEE SENSORS
|
| 2020 | — | conf |
Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB.
IEEE SENSORS
|
| 2020 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2020 | — | conf |
IEEE SENSORS
|
| 2020 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2019 | — | conf |
ISSCC
|
| 2019 | J | jnl |
Integr.
|
| 2019 | J | jnl |
Integr.
|
| 2019 | J | jnl |
IEEE J. Solid State Circuits
|
| 2019 | — | conf |
IEEE SENSORS
|
| 2019 | — | conf |
SMACD
|
| 2019 | — | conf |
ESSDERC
|
| 2018 | — | conf |
PATMOS
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | — | conf |
NGCAS
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | — | conf |
ASHES@CCS
|
| 2018 | — | conf |
A-SSCC
|
| 2018 | A | conf |
DATE
|
| 2018 | — | conf |
PRIME
|
| 2018 | — | conf |
LASCAS
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | — | conf |
ESSCIRC
|
| 2017 | — | conf |
ESSDERC
|
| 2017 | — | conf |
IEEE SENSORS
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | — | conf |
COSADE
|
| 2017 | — | conf |
ESSDERC
|
| 2016 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2016 | J | jnl |
IEEE J. Solid State Circuits
|
| 2016 | C | conf |
Automated design of a 13.56 MHz corner-robust efficient differential drive rectifier for 10 μA load.
ISCAS
|
| 2016 | — | conf |
ICDSC
|
| 2016 | — | conf |
ICECS
|
| 2016 | J | jnl |
IET Circuits Devices Syst.
|
| 2016 | — | conf |
SPACE
|
| 2015 | — | conf |
ESSCIRC
|
| 2015 | J | jnl |
IEEE J. Solid State Circuits
|
| 2015 | J | jnl |
J. Low Power Electron.
|
| 2015 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2015 | C | conf |
ISCAS
|
| 2015 | J | jnl |
Microelectron. Reliab.
|
| 2015 | — | conf |
ICICDT
|
| 2014 | J | jnl |
J. Sensors
|
| 2014 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2014 | J | jnl |
J. Cryptogr. Eng.
|
| 2014 | — | conf |
ESSDERC
|
| 2013 | J | jnl |
Microelectron. Reliab.
|
| 2013 | — | conf |
I2MTC
|
| 2013 | J | jnl |
IEEE J. Solid State Circuits
|
| 2013 | — | conf |
ESSDERC
|
| 2013 | J | jnl |
Sensors
|
| 2013 | J | jnl |
J. Circuits Syst. Comput.
|
| 2012 | — | conf |
ISSCC
|
| 2012 | J | jnl |
J. Low Power Electron.
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2012 | — | conf |
ESSDERC
|
| 2012 | J | jnl |
J. Low Power Electron.
|
| 2011 | A* | conf |
EUROCRYPT
|
| 2011 | J | jnl |
Microelectron. Reliab.
|
| 2011 | J | jnl |
IEEE J. Emerg. Sel. Topics Circuits Syst.
|
| 2011 | J | jnl |
J. Cryptogr. Eng.
|
| 2011 | J | jnl |
Microelectron. Reliab.
|
| 2011 | A | conf |
CHES
|
| 2010 | J | jnl |
Microelectron. Reliab.
|
| 2010 | — | conf |
ESSCIRC
|
| 2010 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2010 | C | conf |
ISCAS
|
| 2010 | — | conf |
ESSCIRC
|
| 2010 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2009 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2009 | A | conf |
ISLPED
|
| 2009 | C | conf |
ISCAS
|
| 2009 | A | conf |
ISLPED
|
| 2008 | C | conf |
ICCD
|
| 2008 | J | jnl |
Microelectron. J.
|
| 2008 | — | conf |
ISVLSI
|
| 2008 | — | conf |
ISVLSI
|
| 2007 | — | conf |
ICECS
|
| 2007 | — | conf |
ICECS
|
| 2007 | J | jnl |
Integr.
|
| 2007 | J | jnl |
J. Multiple Valued Log. Soft Comput.
|
| 2007 | J | jnl |
Microelectron. J.
|
| 2007 | J | jnl |
IEEE J. Solid State Circuits
|
| 2006 | J | jnl |
Microelectron. J.
|
| 2006 | J | jnl |
Microelectron. J.
|
| 2006 | J | jnl |
Microelectron. J.
|
| 2005 | — | conf |
ESSCIRC
|
| 2005 | — | conf |
ISCAS (5)
|
| 2004 | — | conf |
PATMOS
|
| 2004 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2003 | — | conf |
ESSCIRC
|
| 2003 | — | conf |
SBCCI
|
| 2003 | J | jnl |
Microelectron. Reliab.
|
| 2003 | — | conf |
ESSCIRC
|
| 2003 | J | jnl |
IEEE Micro
|
| 2002 | — | conf |
ISCAS (5)
|
| 2002 | A | conf |
ISLPED
|
| 2002 | — | conf |
SBCCI
|
| 2001 | — | conf |
SBCCI
|
| 2001 | C | conf |
VLSI-SOC
|
| 2001 | — | conf |
ETFA (2)
|
| 2001 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2000 | — | conf |
SBCCI
|
| 2000 | — | conf |
BMAS
|
| 1999 | — | conf |
Smartcard
|
| 1998 | J | jnl |
IEEE J. Solid State Circuits
|
| 1997 | J | jnl |
IEEE J. Solid State Circuits
|
| 1996 | J | jnl |
IEEE J. Solid State Circuits
|
| 1996 | J | jnl |
IEEE J. Solid State Circuits
|