| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
ACM Trans. Sens. Networks
|
| 2026 | J | jnl |
Sci. China Inf. Sci.
|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2025 | J | jnl |
Big Data
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | B | conf |
ICPADS
|
| 2025 | J | jnl |
CoRR
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | A* | conf |
INFOCOM
|
| 2025 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | B | conf |
IJCNN
|
| 2025 | A* | conf |
AAAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | B | conf |
ICPADS
|
| 2025 | J | jnl |
ACM Trans. Sens. Networks
|
| 2024 | B | conf |
IWQoS
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2024 | A* | conf |
CVPR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Expert Syst. Appl.
|
| 2024 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
MSN
|
| 2024 | B | conf |
MobiHoc
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2023 | — | conf |
ICCAI
|
| 2023 | A* | conf |
NeurIPS
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Pattern Recognit.
|
| 2023 | J | jnl |
Comput. Electron. Agric.
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2022 | — | conf |
ICITEE
|
| 2022 | — | conf |
ACCV (3)
|
| 2022 | — | conf |
ACCV (4)
|
| 2021 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEICE Trans. Commun.
|
| 2019 | J | jnl |
KSII Trans. Internet Inf. Syst.
|
| 2019 | J | jnl |
Sensors
|
| 2017 | — | conf |
SINC
|
| 2017 | — | conf |
ChinaCom (1)
|
| 2017 | — | conf |
ICNCC
|
| 2016 | J | jnl |
Microelectron. Reliab.
|
| 2016 | J | jnl |
Microelectron. Reliab.
|