| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2026 | A* | conf |
AAAI
|
| 2025 | — | conf |
EDCC-C
|
| 2025 | — | conf |
CAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
WMNC
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | — | conf |
CAI
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
EDCC Workshops
|
| 2021 | J | jnl |
Sensors
|
| 2021 | — | conf |
DASC/PiCom/CBDCom/CyberSciTech
|
| 2020 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2019 | B | conf |
SMC
|
| 2019 | — | conf |
ICSRS
|
| 2018 | C | conf |
PRDC
|
| 2018 | B | conf |
ARES
|
| 2017 | J | jnl |
Microelectron. Reliab.
|
| 2015 | — | conf |
ICCE-Berlin
|
| 2015 | — | conf |
EMC Compo
|
| 2015 | J | jnl |
IET Wirel. Sens. Syst.
|
| 2007 | J | jnl |
J. Comput. Phys.
|