| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Sustain. Comput. Informatics Syst.
|
| 2022 | — | conf |
CDC
|
| 2022 | J | jnl |
CoRR
|
| 2022 | A* | conf |
ICRA
|
| 2022 | J | jnl |
CoRR
|
| 2022 | — | conf |
IEEE SENSORS
|
| 2022 | J | jnl |
IEEE Internet Things J.
|
| 2022 | — | conf |
CHI Extended Abstracts
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
CoRR
|
| 2022 | Misc | conf |
CoRL
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Vacuum-Formed 3D Printed Electronics: Fabrication of Thin, Rigid and Free-Form Interactive Surfaces.
SN Comput. Sci.
|
| 2021 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | A* | conf |
CHI
|
| 2021 | J | jnl |
Vacuum-formed 3D printed electronics: fabrication of thin, rigid and free-form interactive surfaces.
CoRR
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | A | conf |
ICDCS
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Internet Things J.
|
| 2019 | — | conf |
WF-IoT
|
| 2018 | — | conf |
WF-IoT
|
| 2018 | Misc | conf |
SenSys
|
| 2017 | — | conf |
IEEE SENSORS
|
| 2017 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2016 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2016 | — | conf |
IOT
|
| 2016 | J | jnl |
IEEE Pervasive Comput.
|
| 2015 | — | conf |
IOT
|
| 2015 | — | conf |
IoT 360 (2)
|
| 2013 | J | jnl |
IEEE Internet Comput.
|