Dao-Guo Yang

27 papers Journal 26Unranked 1
YearRankTypeTitle / Venue / Authors
2024 J jnl
Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization.
IEEE Trans. Instrum. Meas.
Hengjian He, Miao Cai, Minghui Yun, Hao Chen, Huanhuan Wang, Dao-Guo Yang
2021 J jnl
Entropy-based analysis and classification of acute tonic pain from microwave transcranial signals obtained via the microwave-scattering approach.
Biomed. Signal Process. Control.
Dao-Guo Yang, Daoshuang Geng, Lixia Zheng, Miao Cai, Weidong Hao
2020 J jnl
A Novel Microwave Treatment for Sleep Disorders and Classification of Sleep Stages Using Multi-Scale Entropy.
Entropy
Daoshuang Geng, Dao-Guo Yang, Miao Cai, Lixia Zheng
2020 J jnl
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review.
Entropy
Miao Cai, Peng Cui, Yikang Qin, Daoshuang Geng, Qiqin Wei, Xiyou Wang, Dao-Guo Yang, GuoQi Zhang
2020 J jnl
Evaluation of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Using Multi-Entropy Machine Learning Approach.
IEEE Access
Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao
2019 J jnl
Detection of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Obtained via the Microwave Scattering Approach.
IEEE Access
Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao, Xiaoming Li
2019 J jnl
Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs.
IEEE Access
Miao Cai, Yonghu Liang, Minghui Yun, Xuan-You Chen, Haidong Yan, Zhaozhe Yu, Dao-Guo Yang, GuoQi Zhang
2019 J jnl
Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method.
IEEE Access
Miao Cai, Zhi Liang, Kunmiao Tian, Minghui Yun, Ping Zhang, Dao-Guo Yang, GuoQi Zhang
2018 J jnl
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene.
Sensors
Ning Yang, Dao-Guo Yang, GuoQi Zhang, Liangbiao Chen, Dongjing Liu, Miao Cai, Xuejun Fan
2016 J jnl
Effects of stress-loading test methods on the degradation of light-emitting diode modules.
Microelectron. Reliab.
Miao Cai, Dao-Guo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, GuoQi Zhang, Xianping Chen
2016 J jnl
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test.
Reliab. Eng. Syst. Saf.
Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
2015 J jnl
A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds.
Microelectron. Reliab.
Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang
2015 J jnl
Genetic Algorithm (GA)-Based Inclinometer Layout Optimization.
Sensors
Weijie Liang, Ping Zhang, Xianping Chen, Miao Cai, Dao-Guo Yang
2015 J jnl
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests.
Microelectron. Reliab.
Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
2015 J jnl
Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method.
Microelectron. Reliab.
Miao Cai, Dao-Guo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, GuoQi Zhang
2013 J jnl
A novel soldering method to evaluate PCB pad cratering for pin-pull testing.
Microelectron. Reliab.
Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang
2011 J jnl
Effect of high temperature aging on reliability of automotive electronics.
Microelectron. Reliab.
Dao-Guo Yang, F. F. Wan, Z. Y. Shou, Willem D. van Driel, H. Scholten, L. Goumans, Roberto Faria
2010 J jnl
Designing for reliability using a new Wafer Level Package structure.
Microelectron. Reliab.
Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman
2010 J jnl
Reliability modeling on a MOSFET power package based on embedded die technology.
Microelectron. Reliab.
Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel
2008 — conf
An Optimum Design Method for Nonlinear System Using an Improved Neural Network.
CSSE (1)
Miao Cai, Dao-Guo Yang, Wenbin Chen, Quan-Yong Li
2008 J jnl
On chip-package stress interaction.
Microelectron. Reliab.
W. D. van Driel, Dao-Guo Yang, G. Q. Zhang
2007 J jnl
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectron. Reliab.
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
2007 J jnl
Mechanical reliability challenges for MEMS packages: Capping.
Microelectron. Reliab.
Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang
2007 J jnl
Novel shear tools for viscoelastic characterization of packaging polymers.
Microelectron. Reliab.
C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers
2007 J jnl
Numerical modeling of warpage induced in QFN array molding process.
Microelectron. Reliab.
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
2006 J jnl
Reliability modelling for packages in flexible end-products.
Microelectron. Reliab.
W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
2004 J jnl
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach.
Microelectron. Reliab.
Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang