Daniel H. Jung

13 papers Journal 1Unranked 12

Year	Rank	Type	Title / Venue / Authors
2016	J	`jnl`	High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim
2015	—	`conf`	Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim
2015	—	`conf`	Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2015	—	`conf`	Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim
2015	—	`conf`	TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim
2014	—	`conf`	Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2014	—	`conf`	Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim
2013	—	`conf`	Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013	—	`conf`	Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
2013	—	`conf`	Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013	—	`conf`	Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2013	—	`conf`	Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2013	—	`conf`	Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park