| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | A | conf |
MobiSys
|
| 2024 | — | conf |
IPSN
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | A* | conf |
PERCOM
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2021 | J | jnl |
Des. Autom. Embed. Syst.
|
| 2019 | C | conf |
APNOMS
|
| 2019 | A* | conf |
PerCom
|
| 2019 | C | conf |
APNOMS
|
| 2015 | — | conf |
ASCC
|
| 2015 | J | jnl |
Multim. Syst.
|
| 2014 | — | conf |
ICUIMC
|
| 2014 | J | jnl |
Multim. Tools Appl.
|
| 2013 | J | jnl |
New Rev. Hypermedia Multim.
|
| 2013 | — | conf |
ICME Workshops
|
| 2008 | J | jnl |
IEEE J. Solid State Circuits
|