| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ICAIIC
|
| 2026 | — | conf |
ICAIIC
|
| 2025 | — | conf |
ICAIIC
|
| 2025 | — | conf |
COOL CHIPS
|
| 2025 | — | conf |
HCS
|
| 2025 | — | conf |
MCSoC
|
| 2025 | — | conf |
MCSoC
|
| 2025 | — | conf |
MCSoC
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | — | conf |
ICAIIC
|
| 2025 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | — | conf |
ICEIC
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2024 | — | conf |
COOL CHIPS
|
| 2024 | B | conf |
COMPSAC
|
| 2024 | — | conf |
ISPACS
|
| 2024 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2024 | — | conf |
PerCom Workshops
|
| 2024 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2024 | — | conf |
ISPACS
|
| 2024 | — | conf |
ISPACS
|
| 2024 | — | conf |
DSC
|
| 2024 | — | conf |
GCCE
|
| 2024 | — | conf |
IRC
|
| 2024 | B | conf |
COMPSAC
|
| 2024 | — | conf |
ICTC
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2024 | — | conf |
ICTC
|
| 2024 | C | conf |
TENCON
|
| 2024 | — | conf |
ICEIC
|
| 2024 | — | conf |
Poster: Adaptive Astar Algorithm for Calculation Time Reduction of Autonomous Vehicle's Pathfinding.
VNC
|
| 2024 | — | conf |
VNC
|
| 2024 | — | conf |
ICEIC
|
| 2023 | — | conf |
ICAIIC
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | — | conf |
MWSCAS
|
| 2023 | — | conf |
ICMU
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2023 | C | conf |
ICCE
|
| 2023 | — | conf |
ICTC
|
| 2023 | — | conf |
ICAIIC
|
| 2023 | — | conf |
MCSoC
|
| 2023 | — | conf |
ICEIC
|
| 2023 | — | conf |
ICEIC
|
| 2023 | — | conf |
ICTC
|
| 2023 | J | jnl |
Sensors
|
| 2023 | C | conf |
IECON
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
ICMU
|
| 2023 | — | conf |
ISOCC
|
| 2023 | Misc | conf |
EMSOFT
|
| 2023 | Misc | conf |
EMSOFT
|
| 2022 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2022 | C | conf |
ICCE
|
| 2022 | — | conf |
LifeTech
|
| 2022 | — | conf |
ICTC
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
J. Inf. Process. Syst.
|
| 2022 | — | conf |
ICEIC
|
| 2022 | — | conf |
ISOCC
|
| 2022 | — | conf |
Lightweighted Shallow CTS Techniques for Checking Clock Tree Synthesizable Paths in RTL Design Time.
ISOCC
|
| 2022 | — | conf |
ICCE-TW
|
| 2022 | — | conf |
ICAIIC
|
| 2022 | — | conf |
ISPACS
|
| 2022 | J | jnl |
Sensors
|
| 2022 | — | conf |
IST
|
| 2022 | Misc | conf |
EMSOFT
|
| 2021 | — | conf |
MCSoC
|
| 2021 | — | conf |
ICEIC
|
| 2021 | — | conf |
ICUFN
|
| 2021 | — | conf |
ISOCC
|
| 2021 | — | conf |
ISOCC
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
ICUFN
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
ICUFN
|
| 2021 | J | jnl |
Sensors
|
| 2021 | J | jnl |
IEICE Trans. Electron.
|
| 2021 | C | conf |
ISCAS
|
| 2021 | J | jnl |
J. Inf. Process. Syst.
|
| 2021 | — | conf |
LifeTech
|
| 2021 | — | conf |
ICEIC
|
| 2021 | — | conf |
ICEIC
|
| 2021 | C | conf |
HPC Asia
|
| 2021 | — | conf |
ISPACS
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
LifeTech
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
GCCE
|
| 2020 | J | jnl |
J. Inf. Process. Syst.
|
| 2020 | — | conf |
ICAIIC
|
| 2020 | J | jnl |
Sensors
|
| 2020 | — | conf |
ICCE-TW
|
| 2020 | — | conf |
SIGSIM-PADS
|
| 2020 | — | conf |
COOL CHIPS
|
| 2020 | J | jnl |
Sensors
|
| 2019 | — | conf |
ASP-DAC
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
ICAIIC
|
| 2019 | — | conf |
ICAIIC
|
| 2019 | — | conf |
BigComp
|
| 2019 | — | conf |
DASC/PiCom/DataCom/CyberSciTech
|
| 2019 | — | conf |
ISPACS
|
| 2019 | — | conf |
Graphical Patterning-Platform of Software Malfunction for Power Profile-based Side-Channel Analysis.
ICCE-TW
|
| 2019 | J | jnl |
Multim. Tools Appl.
|
| 2019 | — | conf |
DASC/PiCom/DataCom/CyberSciTech
|
| 2019 | J | jnl |
Sensors
|
| 2019 | — | conf |
DASC/PiCom/DataCom/CyberSciTech
|
| 2019 | J | jnl |
J. Inf. Process. Syst.
|
| 2018 | J | jnl |
Symmetry
|
| 2018 | J | jnl |
Sensors
|
| 2018 | — | conf |
GCCE
|
| 2018 | — | conf |
MCSoC
|
| 2018 | — | conf |
DSC
|
| 2018 | — | conf |
WF-IoT
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
An HLA-Based Formal Co-Simulation Approach for Rapid Prototyping of Heterogeneous Mixed-Signal SoCs.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2017 | J | jnl |
Simul. Model. Pract. Theory
|
| 2017 | — | conf |
GCCE
|
| 2017 | — | conf |
DSC
|
| 2017 | — | conf |
ICUFN
|
| 2017 | — | conf |
CSA/CUTE
|
| 2017 | J | jnl |
Sensors
|
| 2017 | J | jnl |
J. Commun. Networks
|
| 2016 | J | jnl |
Comput. Sci. Eng.
|
| 2016 | — | conf |
GCCE
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | J | jnl |
J. Circuits Syst. Comput.
|
| 2015 | J | jnl |
J. Sensors
|
| 2015 | — | conf |
CCBD
|
| 2015 | — | conf |
FCST
|
| 2015 | — | conf |
UIC/ATC/ScalCom
|
| 2015 | — | conf |
NBiS
|
| 2015 | — | conf |
FNC/MobiSPC
|
| 2015 | — | conf |
GCCE
|
| 2015 | — | conf |
GCCE
|
| 2014 | — | conf |
ICITCS
|
| 2014 | — | conf |
ICCE-TW
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | C | conf |
VLSI-SoC
|
| 2014 | — | conf |
ICITCS
|
| 2014 | — | conf |
ICITCS
|
| 2013 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2013 | — | conf |
ICCE-Berlin
|
| 2013 | — | conf |
GCCE
|
| 2012 | — | conf |
SpringSim (TMS-DEVS)
|
| 2011 | — | conf |
COOL Chips
|