Chuan Seng Tan

27 papers Journal 7Unranked 18
YearRankTypeTitle / Venue / Authors
2024 J jnl
Recognizing Beam Profiles from Silicon Photonics Gratings using Transformer Model.
CoRR
Yu Dian Lim, Hong Yu Li, Simon Chun Kiat Goh, Xiangyu Wang, Peng Zhao, Chuan Seng Tan
2021 — conf
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions.
3DIC
Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan
2020 — conf
Monolithically Integrated GaN+CMOS Logic Circuits Design and Electro-Thermal Analysis for High-Voltage Applications.
BCICTS
Pilsoon Choi, Bugra Kanargi, Kenneth E. Lee, Chirn Chye Boon, Evelyn Wang, Chuan Seng Tan, Dimitri A. Antoniadis, Eugene A. Fitzgerald
2019 — conf
Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration.
3DIC
Jing Tao, Hongyu Li, Peng Zhao, Yu Dian Lim, Anak Agung Alit Apriyana, Chuan Seng Tan
2019 — conf
Mid Infrared Volatile Compounds Detection Using Thermally Reflowed Flip-Stack Die Linear Variable Filter.
IEEE SENSORS
Simon Chun Kiat Goh, Kailiang Chuan, Chengkuo Lee, Chuan Seng Tan
2019 — conf
TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center.
3DIC
Alit Apriyana Anak Agung, Peng Zhao, Chuan Seng Tan
2018 — conf
Two-Step Fabrication of Mid-Infrared Linear Variable Optical Filter Using SU-8 as Mask.
NEMS
Simon Chun Kiat Goh, Li Lynn Shiau, Nan Chen, Kailiang Chuan, Beng Kang Tay, Chuan Seng Tan
2017 J jnl
Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs.
IEEE Trans. Very Large Scale Integr. Syst.
Myat Thu Linn Aung, Takefumi Yoshikawa, Chuan Seng Tan, Tony Tae-Hyoung Kim
2016 J jnl
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.
Microelectron. Reliab.
Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan
2016 — conf
Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element.
3DIC
Ye Lin, Chuan Seng Tan
2015 — conf
Copper micro and nano particles mixture for 3D interconnections application.
3DIC
Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan
2014 J jnl
Robust Electromigration reliability through engineering optimization.
Microelectron. Reliab.
Wee Loon Ng, Kheng Chok Tee, Junfeng Liu, Yong Chiang Ee, Oliver Aubel, Chuan Seng Tan, Kin Leong Pey
2014 — conf
Simulation and design of AIN piezoelectric resonator for infrared sensing application utilizing lamb wave mode.
ISSNIP
Wan Chia Ang, Piotr Kropelmcki, Andrew Benson Randies, Alex Yuandong Gu, Kam Chew Leong, Chuan Seng Tan
2013 — conf
Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges.
3DIC
Kaushik Ghosh, C. C. Yap, Beng Kang Tay, Chuan Seng Tan
2013 J jnl
Reliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical-Thermal-Mechanical Coupling.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sai Manoj Pudukotai Dinakarrao, Hao Yu, Yang Shang, Chuan Seng Tan, Sung Kyu Lim
2013 — conf
The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material.
3DIC
Jiye Zhang, Lin Zhang, Yuanwei Dong, Hongyu Li, Cher Ming Tan, Guangrui Xia, Chuan Seng Tan
2013 — conf
Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model.
ASP-DAC
Yang Shang, Chun Zhang, Hao Yu, Chuan Seng Tan, Xin Zhao, Sung Kyu Lim
2012 J jnl
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.
Microelectron. Reliab.
Chuan Seng Tan, Dau Fatt Lim, Xiao Fang Ang, Jun Wei, K. C. Leong
2011 — conf
3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds.
3DIC
Revanth Nadipalli, Ji Fan, Holden King Ho Li, Keng Hoong Wee, Hao Yu, Chuan Seng Tan
2011 J jnl
Integration schemes and enabling technologies for three-dimensional integrated circuits.
IET Comput. Digit. Tech.
Kuan-Neng Chen, Chuan Seng Tan
2011 — conf
Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone.
3DIC
Dau Fatt Lim, K. C. Leong, Chuan Seng Tan
2011 — ch.
Three-Dimensional Integration of Integrated Circuits - an Introduction.
3D Integration for NoC-based SoC Architectures
Chuan Seng Tan
2010 — conf
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.
3DIC
Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan
2009 — conf
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.
3DIC
Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan
2009 — conf
Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack.
3DIC
Shiv Govind Singh, Chuan Seng Tan
2006 — —
Multi-layer 3D silicon electronics enabled by wafer bonding.
Chuan Seng Tan
2004 — conf
Technology, performance, and computer-aided design of three-dimensional integrated circuits.
ISPD
Shamik Das, Andy Fan, Kuan-Neng Chen, Chuan Seng Tan, Nisha Checka, Rafael Reif