Chris Bailey

35 papers A 1Misc 1Journal 33
YearRankTypeTitle / Venue / Authors
2026 J jnl
Defect-Aware Built-In Self-Test and Dynamic Repair for Fan-Out Wafer-Level Packaging.
IEEE Trans. Very Large Scale Integr. Syst.
Partho Bhoumik, Chris Bailey, Krishnendu Chakrabarty
2026 J jnl
The Prosocial Ranking Challenge: Reducing Polarization on Social Media without Sacrificing Engagement.
CoRR
Jonathan Stray, Ian Baker, George Beknazar-Yuzbashev, Ceren Budak, Julia Kamin, Kylan Rutherford, Mateusz Stalinski, Tin Acosta, Chris Bailey, Michael S. Bernstein, Mark Brandt, Amy Bruckman, Anshuman Chhabra, Soham De, Kayla Duskin, Sara Fish, Beth Goldberg, Andy Guess, Dylan Hadfield-Menell, Muhammad Haroon, Safwan Hossain, Michael Inzlicht, Gauri Jain, Yanchen Jiang, Alexander P. Landry, Yph Lelkes, Hongfan Lu, Peter Mason, Jennifer McCoy, Smitha Milli, Paul Resnick, Emily Saltz, Martin Saveski, Lisa Schirch, Max Spohn, Siddarth Srinivasan, Alexis Tatore, Luke Thorburn, Joshua A. Tucker, Robb Willer, Magdalena Wojcieszak, Manuel Wüthrich, Sylvan Zheng
2024 J jnl
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module.
IEEE Access
Pushparajah Rajaguru, Tim Tilford, Chris Bailey, Stoyan Stoyanov
2024 A conf
Package Modeling and Analysis for Heterogeneous Integration.
ICCAD
Chris Bailey, Leslie Hwang, Fnu Pallavi Praful
2023 J jnl
Modeling Insights Into the Assembly Challenges of Focal Plane Arrays.
IEEE Access
Stoyan Stoyanov, Chris Bailey
2020 J jnl
Developing Computational Intelligence for Smart Qualification Testing of Electronic Products.
IEEE Access
Mominul Ahsan, Stoyan Stoyanov, Chris Bailey, Alhussein Albarbar
2019 J jnl
Data analytics to reduce stop-on-fail test in electronics manufacturing.
Open Comput. Sci.
Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin
2019 J jnl
Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications.
IEEE Access
Fateme Dinmohammadi, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu
2019 J jnl
Predictive analytics methodology for smart qualification testing of electronic components.
J. Intell. Manuf.
Stoyan Stoyanov, Mominul Ahsan, Chris Bailey, Tracy Wotherspoon, Craig Hunt
2018 J jnl
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectron. Reliab.
Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey
2018 J jnl
Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radar.
IEEE Access
Jamie Blanche, David Flynn, Helen Lewis, Gary D. Couples, Jim Buckman, Chris Bailey, Tim Tilford
2018 J jnl
Design, manufacture and test for reliable 3D printed electronics packaging.
Microelectron. Reliab.
Tim Tilford, Stoyan Stoyanov, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey
2018 J jnl
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables.
Microelectron. Reliab.
Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, Florin Udrea
2017 J jnl
Evaluation of SiC Schottky Diodes Using Pressure Contacts.
IEEE Trans. Ind. Electron.
Jose Angel Ortiz Gonzalez, Olayiwola Alatise, Attahir Murtala Aliyu, Pushparajah Rajaguru, Alberto Castellazzi, Li Ran, Philip Mawby, Chris Bailey
2017 J jnl
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Microelectron. Reliab.
Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise
2016 J jnl
Similarity approach for reducing qualification tests of electronic components.
Microelectron. Reliab.
Stoyan Stoyanov, Chris Bailey, Georgios Tourloukis
2015 J jnl
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.
Microelectron. Reliab.
Pushparajah Rajaguru, Hua Lu, Chris Bailey
2015 J jnl
Modelling the impact of refinishing processes on COTS components for use in aerospace applications.
Microelectron. Reliab.
Stoyan Stoyanov, Chris Bailey
2015 J jnl
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectron. Reliab.
Pushparajah Rajaguru, Hua Lu, Chris Bailey
2015 J jnl
Statistical analysis of the impact of refinishing process on leaded components.
Microelectron. Reliab.
Chunyan Yin, Chris Best, Chris Bailey, Stoyan Stoyanov
2014 J jnl
Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules.
Microelectron. Reliab.
Mahera Musallam, Chunyan Yin, Chris Bailey, C. Mark Johnson
2014 Misc conf
New topic session 2B: Co-design and reliability of power electronic modules - Current status and future challenges.
VTS
Bozena Kaminska, Bernard Courtois, Chris Bailey
2013 J jnl
Modelling methodology for thermal analysis of hot solder dip process.
Microelectron. Reliab.
Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott
2012 J jnl
Prognostics and Health Monitoring of High Power LED.
Micromachines
Thamo Sutharssan, Stoyan Stoyanov, Chris Bailey, Yasmine Z. Rosunally
2011 J jnl
Fusion Approach for Prognostics Framework of Heritage Structure.
IEEE Trans. Reliab.
Yasmine Z. Rosunally, Stoyan Stoyanov, Chris Bailey, Peter Mason, Sheelagh Campbell, George Monger, Ian Bell
2011 J jnl
Integration of analytical techniques in stochastic optimization of microsystem reliability.
Microelectron. Reliab.
Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov
2010 J jnl
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.
Microelectron. Reliab.
E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas
2009 J jnl
Design for reliability of power electronics modules.
Microelectron. Reliab.
Hua Lu, Chris Bailey, Chunyan Yin
2008 J jnl
Failure mechanisms of ACF joints under isothermal ageing.
Microelectron. J.
M. J. Rizvi, Chris Bailey, Hua Lu
2008 J jnl
Open Ended Microwave Oven for Packaging
CoRR
Keith I. Sinclair, Tim Tilford, Marc P. Y. Desmulliez, George Goussetis, Chris Bailey, Kevin Parrott, Alan J. Sangster
2007 J jnl
Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives.
Microelectron. Reliab.
Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez
2006 J jnl
Assessing the performance of crack detection tests for solder joints.
Microelectron. Reliab.
Stephen Ridout, Milos Dusek, Chris Bailey, Chris Hunt
2005 J jnl
Study of anisotropic conductive adhesive joint behavior under 3-point bending.
Microelectron. Reliab.
M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu
2003 J jnl
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectron. Reliab.
Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu
2002 J jnl
No-flow underfill flip chip assembly--an experimental and modeling analysis.
Microelectron. Reliab.
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan