Chew Wye Chan - RankMe

12 papers Misc 9Journal 2Unranked 1

Year	Rank	Type	Title / Venue / Authors
2025	J	`jnl`	Learning to Optimize Capacity Planning in Semiconductor Manufacturing. CoRR Philipp Andelfinger, Jieyi Bi, Qiuyu Zhu, Jianan Zhou, Bo Zhang, Feifei Zhang, Chew Wye Chan, Boon Ping Gan, Wentong Cai, Jie Zhang
2025	J	`jnl`	Scalability of Reinforcement Learning Methods for Dispatching in Semiconductor Frontend Fabs: A Comparison of Open-Source Models with Real Industry Datasets. CoRR Patrick Stöckermann, Henning Südfeld, Alessandro Immordino, Thomas Altenmüller, Marc Wegmann, Martin Gebser, Konstantin Schekotihin, Georg Seidel, Chew Wye Chan, Feifei Zhang
2024	Misc	`conf`	A Standard Framework for AI-Driven Optimizations in Various Complex Domains. WSC Tobias Bosse, Evangelos Angelidis, Feifei Zhang, Chew Wye Chan, Boon Ping Gan, Matthias Werner, Andrej Gisbrecht
2024	Misc	`conf`	Enhancing Machine Learning for Situation Aware Dispatching Through Generative Adversarial Network Based Synthetic Data Generation. WSC Chew Wye Chan, Boon Ping Gan, Wentong Cai
2023	Misc	`conf`	Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing. WSC Chew Wye Chan, Boon Ping Gan, Wentong Cai
2023	Misc	`conf`	Dispatching in Real Frontend Fabs With Industrial Grade Discrete-Event Simulations by Deep Reinforcement Learning with Evolution Strategies. WSC Patrick Stöckermann, Alessandro Immordino, Thomas Altenmüller, Georg Seidel, Martin Gebser, Pierre Tassel, Chew Wye Chan, Feifei Zhang
2022	Misc	`conf`	Graph Representation and Embedding for Semiconductor Manufacturing Fab States. WSC Benedikt Schulz, Christoph Jacobi, Andrej Gisbrecht, Evangelos Angelidis, Chew Wye Chan, Boon Ping Gan
2020	—	`conf`	Runtime Abstraction-Level Conversion of Discrete-Event Wafer-fabrication Models for Simulation Acceleration. SIGSIM-PADS Moon Gi Seok, Chew Wye Chan, Wentong Cai, Hessam S. Sarjoughian, Daejin Park
2020	Misc	`conf`	Towards Situation Aware Dispatching in a Dynamic and Complex Manufacturing Environment. WSC Chew Wye Chan, Boon Ping Gan, Wentong Cai
2019	Misc	`conf`	An Integration of Static and Dynamic Capacity Planning for a Ramping Fab. WSC Georg Seidel, Patrick Preuss, Cevahir Canbolat, Soo Leen Low, Chew Wye Chan, Boon Ping Gan, Ching Foong Lee, Prakash Manogaran, Aik Ying Tang
2018	Misc	`conf`	Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation. WSC Georg Seidel, Patrick Preuss, André Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan
2017	Misc	`conf`	Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation. WSC Georg Seidel, Ching Foong Lee, Ai Mei Kam, Boon-Ping Gan, Chew Wye Chan, André Naumann, Patrick Preuss