Cher Ming Tan

55 papers Journal 51Unranked 3
YearRankTypeTitle / Venue / Authors
2023 — conf
Concurrent Multiband CMOS Low Noise Amplifier Design for Internet of Things Applications.
ASICON
Peerapat Phetpadriew, Bharatha Kumar Thangarasu, Nagarajan Mahalingam, Zhenghao Lu, Cher Ming Tan, Kiat Seng Yeo
2022 J jnl
Effect of resistor tolerance on the performance of resistor network - An application of the statistical design of experiment.
Int. J. Circuit Theory Appl.
Vimal Kant Pandey, Cher Ming Tan
2020 J jnl
Electromagnetic Induced Failure in GaN-HEMT High-Frequency Power Amplifier.
IEEE Trans. Ind. Electron.
Vivek Sangwan, Cher Ming Tan, Dipesh Kapoor, Hsien-Chin Chiu
2018 — conf
A miniaturized T-shaped MIMO antenna for X-band and Ku-band applications with enhanced radiation efficiency.
WOCC
Nirdosh, Cher Ming Tan, Malay Ranjan Tripathy
2018 J jnl
Uncover the Degradation Science of Silicone Under the Combined Temperature and Humidity Conditions.
IEEE Access
Preetpal Singh, Cher Ming Tan
2016 J jnl
A review on the humidity reliability of high power white light LEDs.
Microelectron. Reliab.
Preetpal Singh, Cher Ming Tan
2016 J jnl
Copper induced synthesis of graphene using amorphous carbon.
Microelectron. Reliab.
Udit Narula, Cher Ming Tan, Chao-Sung Lai
2016 J jnl
Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation.
Microelectron. Reliab.
Preetpal Singh, Cher Ming Tan, Liann-Be Chang
2016 J jnl
Editorial.
Microelectron. Reliab.
Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou
2016 J jnl
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.
Microelectron. Reliab.
Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan
2015 J jnl
A reliability-based design concept for lithium-ion battery pack in electric vehicles.
Reliab. Eng. Syst. Saf.
Zhitao Liu, Cher Ming Tan, Feng Leng
2014 J jnl
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter.
Microelectron. Reliab.
Cher Ming Tan, Wen Zhi Yu
2014 J jnl
Methodology of reliability enhancement for high power LED driver.
Microelectron. Reliab.
Song Lan, Cher Ming Tan, Kevin Wu
2014 J jnl
Modeling and analysis of gate-all-around silicon nanowire FET.
Microelectron. Reliab.
Xiangchen Chen, Cher Ming Tan
2014 J jnl
Special section reliability and variability of devices for circuits and systems.
Microelectron. Reliab.
Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou
2013 J jnl
Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspection scheduling.
Reliab. Eng. Syst. Saf.
Minh Duc Le, Cher Ming Tan
2013 — conf
The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material.
3DIC
Jiye Zhang, Lin Zhang, Yuanwei Dong, Hongyu Li, Cher Ming Tan, Guangrui Xia, Chuan Seng Tan
2012 J jnl
Applications of finite element methods for reliability study of ULSI interconnections.
Microelectron. Reliab.
Cher Ming Tan, Wei Li, Zhenghao Gan
2012 J jnl
Degradation behavior of high power light emitting diode under high frequency switching.
Microelectron. Reliab.
Sihan Chen, Cher Ming Tan, Guan Hong Tan, Feifei He
2012 J jnl
Effect of IC layout on the reliability of CMOS amplifiers.
Microelectron. Reliab.
Feifei He, Cher Ming Tan
2012 J jnl
Electromigration reliability of interconnections in RF low noise amplifier circuit.
Microelectron. Reliab.
Feifei He, Cher Ming Tan
2012 J jnl
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test.
Microelectron. Reliab.
Sihan Joseph Chen, Cher Ming Tan, Boon Khai Eric Chen, Zhi Yong Shaun Chua
2012 J jnl
ICMAT 2011 - Reliability and variability of semiconductor devices and ICs.
Microelectron. Reliab.
Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou
2012 J jnl
Reliability study of LED driver - A case study of black box testing.
Microelectron. Reliab.
Song Lan, Cher Ming Tan, Kevin Wu
2010 J jnl
Addressing the challenges in solder resistance measurement for electromigration test.
Microelectron. Reliab.
Yung Chuen Tan, Cher Ming Tan, T. C. Ng
2010 J jnl
Circuit level interconnect reliability study using 3D circuit model.
Microelectron. Reliab.
Feifei He, Cher Ming Tan
2010 — book
Electromigration in ULSI Interconnections
Cher Ming Tan
2010 J jnl
Electromigration performance of Through Silicon Via (TSV) - A modeling approach.
Microelectron. Reliab.
Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu
2010 J jnl
Humidity study of a-Si PV cell.
Microelectron. Reliab.
Cher Ming Tan, Boon Khai Eric Chen, Kok Peng Toh
2010 J jnl
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model.
Microelectron. Reliab.
Feifei He, Cher Ming Tan
2010 J jnl
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects.
Microelectron. Reliab.
C. M. Fu, Cher Ming Tan, S. H. Wu, H. B. Yao
2009 J jnl
Analysis of humidity effects on the degradation of high-power white LEDs.
Microelectron. Reliab.
Cher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu
2009 J jnl
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI).
Microelectron. Reliab.
Jie Liao, Cher Ming Tan, Geert Spierings
2009 J jnl
Electromigration in width transition copper interconnect.
Microelectron. Reliab.
Arijit Roy, Yuejin Hou, Cher Ming Tan
2009 J jnl
Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems".
Reliab. Eng. Syst. Saf.
Cher Ming Tan, Nagarajan Raghavan
2008 J jnl
A framework to practical predictive maintenance modeling for multi-state systems.
Reliab. Eng. Syst. Saf.
Cher Ming Tan, Nagarajan Raghavan
2008 J jnl
Reverse Breakdown Voltage Measurement for Power P
J. Electron. Test.
Guangyu Huang, Cher Ming Tan
2007 J jnl
An approach to statistical analysis of gate oxide breakdown mechanisms.
Microelectron. Reliab.
Cher Ming Tan, Nagarajan Raghavan
2007 J jnl
Enhanced finite element modelling of Cu electromigration using ANSYS and matlab.
Microelectron. Reliab.
Wei Li, Cher Ming Tan
2007 J jnl
Finite element modeling of capacitive coupling voltage contrast.
Microelectron. Reliab.
Cher Ming Tan, Stanny Yanuar, Tai Chong Chai
2007 J jnl
Room temperature observation of point defect on gold surface using thermovoltage mapping.
Microelectron. Reliab.
Arijit Roy, Cher Ming Tan, Sean J. O'Shea, Kedar Hippalgaonkar, Wulf Hofbauer
2006 J jnl
Development of highly accelerated electromigration test.
Microelectron. Reliab.
Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low
2006 J jnl
Device level electrical-thermal-stress coupled-field modeling.
Microelectron. Reliab.
Guangyu Huang, Cher Ming Tan
2006 J jnl
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.
Microelectron. Reliab.
Arijit Roy, Cher Ming Tan
2006 J jnl
Feasibility study of the application of voltage contrast to printed circuit board.
Microelectron. Reliab.
Cher Ming Tan, Zhenghao Gan, Tai Chong Chai
2005 J jnl
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications.
Microelectron. Reliab.
Cher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu
2005 J jnl
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
Microelectron. Reliab.
Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen
2005 J jnl
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.
Microelectron. Reliab.
Cher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low
2005 J jnl
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.
Microelectron. Reliab.
Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim
2005 J jnl
Reliability screening through electrical testing for press-fit alternator power diode in automotive application.
Microelectron. Reliab.
Cher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang
2004 J jnl
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology.
Microelectron. Reliab.
Guan Zhang, Cher Ming Tan, Kok Tong Tan, Derek Sim Kwang Ye, W. Y. Zhang
2003 J jnl
Influence Of Applied Load On Wafer Bonding In Vacuum.
Int. J. Comput. Eng. Sci.
W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai
2003 J jnl
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.
Int. J. Comput. Eng. Sci.
S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie
2001 J jnl
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).
J. Electron. Test.
Cher Ming Tan, Kelvin Ngan Chong Yeo
1999 J jnl
Using power diode models for circuit simulations-a comprehensive review.
IEEE Trans. Ind. Electron.
Cher Ming Tan, King-Jet Tseng