Cheng Li

11 papers Journal 4Unranked 7
YearRankTypeTitle / Venue / Authors
2020 J jnl
A Study of Transient Voltage Peaking in Diode-Based ESD Protection Structures in 28nm CMOS.
IEEE Access
Chenkun Wang, Feilong Zhang, Fei Lu, Qi Chen, Cheng Li, Albert Z. Wang
2019 J jnl
A Full-Chip ESD Protection Circuit Simulation and Fast Dynamic Checking Method Using SPICE and ESD Behavior Models.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Feilong Zhang, Chenkun Wang, Fei Lu, Qi Chen, Cheng Li, X. Shawn Wang, Daguang Li, Albert Z. Wang
2019 — conf
Developing 3D Heterogeneous Structures for Future Chips.
ICICDT
Cheng Li, Feilong Zhang, Mengfu Di, Zijin Pan, Albert Z. Wang
2019 J jnl
Visible Light Communication Cyber-Physical Systems-on- Chip for Smart Cities.
J. Commun.
Zijin Pan, Tian Lang, Cheng Li, Mengfu Di, Gang Chen, Yehuda E. Kalay, Ramdas Pai, Albert Z. Wang
2018 — conf
3D heterogeneous integration enabling future RF ICs.
RWS
Qi Chen, Chenkun Wang, Feilong Zhang, Cheng Li, Albert Z. Wang
2018 — conf
A study of impacts of ESD protection on 28/38GHz RF switches in 45nm SOI CMOS for 5G mobile applications.
RWS
Chenkun Wang, Fei Lu, Qi Chen, Feilong Zhang, Cheng Li, Dawn Wang, Albert Z. Wang
2017 — conf
Characterization of single-crystalline graphene ESD interconnects.
ASICON
Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, Tianru Wu, Xiaoming Xie, Kun Zhang, Xinxin Li, Jimmy Ng, Ya-Hong Xie, Yuhua Cheng, Albert Z. Wang
2017 — conf
Key note: Integrated design-for-reliability for ICs.
LASCAS
Albert Z. Wang, Fei Lu, Qi Chen, Chenkun Wang, Cheng Li, Feilong Zhang
2017 — conf
More-Than-Moore: 3D heterogeneous integration into CMOS technologies.
NEMS
Albert Z. Wang, Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, X. Shawn Wang, Jimmy Ng, Ya-Hong Xie, Rui Ma, Li Wang, Lin Lin
2017 — conf
TLP measurement and analysis of graphene NEMS switches for on-chip ESD protection.
NEMS
Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, Albert Z. Wang, Jimmy Ng, Ya-Hong Xie
2016 J jnl
A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.
IEEE Trans. Circuits Syst. I Regul. Pap.
Fei Lu, Rui Ma, Zongyu Dong, Li Wang, Chen Zhang, Chenkun Wang, Qi Chen, X. Shawn Wang, Feilong Zhang, Cheng Li, He Tang, Yuhua Cheng, Albert Z. Wang