Cheng-Yao Lo

21 papers Journal 10Unranked 11
YearRankTypeTitle / Venue / Authors
2026 J jnl
A 75.47 TOPS/W 4-kb Single-Ended SRAM-Based Compute-in-Memory Architecture Using 16-nm FinFET Technology.
J. Signal Process. Syst.
L. S. S. Pavan Kumar Chodisetti, Cheng-Yao Lo, Jeffrey Sean Walling, Yang Yi, Leenendra Chowdary Gunnam, Chua-Chin Wang
2024 — conf
A 266.7 TOPS/W Computing-in Memory Using Single-Ended 6T 4-kb SRAM in 16-nm FinFET CMOS Process.
AICAS
Cheng-Yao Lo, Lean Karlo Santos Tolentino, Jhih-Ying Ke, Jeffrey S. Walling, Yang Yi, Chua-Chin Wang
2024 J jnl
A 6-Gbps 16-nm FinFET CMOS I/O Buffer With Variation Insensitivity Ensured by Genetic Algorithm.
IEEE Trans. Circuits Syst. I Regul. Pap.
Chua-Chin Wang, L. S. S. Pavan Kumar Chodisetti, Jhih-Ying Ke, Cheng-Yao Lo, Tzung-Je Lee, Lean Karlo Santos Tolentino
2024 — conf
Composite and Stretchable Silicone for Niche Profiling Applications.
IEEE SENSORS
Padmanabh Pundrikaksha Pancham, Anupam Mukherjee, Teng-Chung Liu, Kun-Han Lin, Wen-Hsin Chiu, Chiang Liu, Cheng-Yao Lo
2024 — conf
GA-Optimized 6.0-Gbps DDR5 SDRAM I/O Buffer Design for 16-nm FinFET CMOS Process.
AICAS
Jhih-Ying Ke, Lean Karlo Santos Tolentino, Cheng-Yao Lo, Tzung-Je Lee, Chua-Chin Wang
2024 J jnl
Integrated Automatic Optical Inspection and Image Processing Procedure for Smart Sensing in Production Lines.
Sensors
Rong-Qing Qiu, Mu-Lin Tsai, Yu-Wen Chen, Shivendra Pratap Singh, Cheng-Yao Lo
2023 — conf
A 2.6-GHz I/O Buffer for DDR4 & DDR5 SDRAMs in 16-nm FinFET CMOS Process.
APCCAS
Jhih-Ying Ke, Lean Karlo S. Tolentino, Cheng-Yao Lo, Tzung-Je Lee, Chua-Chin Wang
2022 — conf
Capacitive Tactile Sensor with Stacked Structure and Hybrid Fabrication for Multiaxial Force Decoupling.
IEEE SENSORS
Jie Ying Wu, Padmanabh Pundrikaksha Pancham, Tzu-Yi Hsu, Anupam Mukherjee, Cheng-Yao Lo
2021 — conf
Capacitive Pressure Sensing Unit for Racket Sports.
IEEE SENSORS
Ye-Jin Zheng, Wei-Cheng Wang, Rongshun Chen, Wen-Hsin Chiu, Yi-yang Chen, Cheng-Yao Lo
2020 — conf
Advanced Capacitor Arrangement for Enhanced Spatial Resolution in Tactile Sensors.
IEEE SENSORS
Shi-Yu Ke, Yu-Wen Chen, Rongshun Chen, Cheng-Yao Lo
2020 J jnl
Linear strain maximization in MEMS-elastomer hybrid configurations for isotropic electromagnetic modulations in stretchable electronics.
Displays
Kuo-Feng Chiu, Subodh Kumar, Yu-Wen Chen, Cheng-Yao Lo
2019 J jnl
An integrated method based on energy concentration for evaluating normally distributed spectra in the visible region.
Displays
Yu-Tang Hu, Yi-Chu Chen, Andrei Vladimirovich Vasenin, Markéta Florianová, Kuo-Feng Chiu, Chih-Liang Pan, Cheng-Yao Lo
2019 — conf
Barium Titanate Elastomer composite based capacitive stretch sensor.
AIM
Eshwar Reddy Cholleti, Jonathan Stringer, Chris R. Bowen, Cheng-Yao Lo, Kean C. Aw
2019 — conf
Extensive Sensitivity Enhancement in Stacked Capacitive Tactile Sensors.
IEEE SENSORS
Yu-Hao Jen, Chia-Tso Mo, Kean C. Aw, Daisuke Yamane, Cheng-Yao Lo
2019 — conf
Isotropic Nanophotonic Modulation with Hybrid Configuration for Surface Plasmon Resonance Application.
NEMS
Yu-Tang Hu, Kuo-Feng Chiu, Ting-Jeng Liu, Cheng-Yao Lo
2018 J jnl
Numerical analysis of a microelectromechanical system-based color filtering device with surface plasmon resonance modulation.
Displays
Shih-Chun Lo, Yu-Tang Hu, Chih-Liang Pan, Cheng-Yao Lo
2017 — conf
Morphology and conductivity enhancement of metal mesh in OLEDs by near infrared and intense pulse light.
NEMS
Li-Wen Wang, Cheng-Yao Lo
2016 J jnl
Soft materials and flexible structures for display technologies.
Displays
Cheng-Yao Lo
2014 J jnl
Thermoresistive Strain Sensor and Positioning Method for Roll-to-Roll Processes.
Sensors
Kuan-Hsun Liao, Cheng-Yao Lo
2012 J jnl
A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing.
Sensors
Yi-Ren Huang, Sheng-An Kuo, Michal Stach, Chia-Hsing Liu, Kuan-Hsun Liao, Cheng-Yao Lo
2008 J jnl
Toward realization of transmissive display by MEMS etalon.
IEICE Electron. Express
Cheng-Yao Lo, Hiroyuki Fujita, Hiroshi Toshiyoshi