Chang-Lin Yeh

14 papers Journal 14
YearRankTypeTitle / Venue / Authors
2011 J jnl
Characteristic of copper wire and transient analysis on wirebonding process.
Microelectron. Reliab.
Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai
2008 J jnl
Effects of different drop test conditions on board-level reliability of chip-scale packages.
Microelectron. Reliab.
Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh
2008 J jnl
Finite element model verification for packaged printed circuit board by experimental modal analysis.
Microelectron. Reliab.
Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
2008 J jnl
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai
2008 J jnl
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.
Microelectron. Reliab.
Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
2007 J jnl
Empirical correlation between package-level ball impact test and board-level drop reliability.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen
2007 J jnl
Evaluation of solder joint strengths under ball impact test.
Microelectron. Reliab.
Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh
2007 J jnl
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses.
Microelectron. Reliab.
Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen
2007 J jnl
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition.
Microelectron. Reliab.
Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai
2006 J jnl
Evaluation of board-level reliability of electronic packages under consecutive drops.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao
2006 J jnl
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.
Microelectron. Reliab.
Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh
2006 J jnl
Support excitation scheme for transient analysis of JEDEC board-level drop test.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai
2006 J jnl
Transient fracturing of solder joints subjected to displacement-controlled impact loads.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai
2005 J jnl
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai