Chang-Chun Lee

12 papers Journal 10Unranked 2

Year	Rank	Type	Title / Venue / Authors
2025	J	`jnl`	Mechanical reliability of high-power modules via simulation-based machine learning. Eng. Appl. Artif. Intell. Chang-Chun Lee, Wei-Cheng Tsai, Jui-Chang Chuang
2023	—	`conf`	A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. IRPS Y. H. Lin, Chang-Chun Lee, C. Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao
2023	—	`conf`	Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation. IRPS Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee
2022	J	`jnl`	Neural Architecture Search for Inversion. CoRR Cheng Zhan, Licheng Zhang, Xin Zhao, Chang-Chun Lee, Shujiao Huang
2018	J	`jnl`	Effect of contact-etch-stop-layer and Si Microelectron. Reliab. Chang-Chun Lee, Chuan-Hsi Liu, Dian-Yong Li, Chia-Ping Hsieh
2015	J	`jnl`	Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. Microelectron. Reliab. Tao-Chih Chang, Chang-Chun Lee, Chia-Ping Hsieh, Sheng-Che Hung, Ren-Shin Cheng
2015	J	`jnl`	Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology. Microelectron. Reliab. Chang-Chun Lee, Chien-Chao Huang
2012	J	`jnl`	Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectron. Reliab. Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang
2011	J	`jnl`	Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. Microelectron. Reliab. T. Y. Hung, S. Y. Chiang, C. J. Huang, Chang-Chun Lee, Kuo-Ning Chiang
2007	J	`jnl`	Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. Microelectron. Reliab. C. C. Chiu, H. H. Chang, Chang-Chun Lee, C. C. Hsia, Kuo-Ning Chiang
2007	J	`jnl`	Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang
2006	J	`jnl`	A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectron. Reliab. Robin C. J. Wang, Chang-Chun Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao