Chang-Chun Lee

12 papers Journal 10Unranked 2
YearRankTypeTitle / Venue / Authors
2025 J jnl
Mechanical reliability of high-power modules via simulation-based machine learning.
Eng. Appl. Artif. Intell.
Chang-Chun Lee, Wei-Cheng Tsai, Jui-Chang Chuang
2023 — conf
A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects.
IRPS
Y. H. Lin, Chang-Chun Lee, C. Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao
2023 — conf
Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation.
IRPS
Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee
2022 J jnl
Neural Architecture Search for Inversion.
CoRR
Cheng Zhan, Licheng Zhang, Xin Zhao, Chang-Chun Lee, Shujiao Huang
2018 J jnl
Effect of contact-etch-stop-layer and Si
Microelectron. Reliab.
Chang-Chun Lee, Chuan-Hsi Liu, Dian-Yong Li, Chia-Ping Hsieh
2015 J jnl
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology.
Microelectron. Reliab.
Tao-Chih Chang, Chang-Chun Lee, Chia-Ping Hsieh, Sheng-Che Hung, Ren-Shin Cheng
2015 J jnl
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology.
Microelectron. Reliab.
Chang-Chun Lee, Chien-Chao Huang
2012 J jnl
Light degradation test and design of thermal performance for high-power light-emitting diodes.
Microelectron. Reliab.
Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang
2011 J jnl
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test.
Microelectron. Reliab.
T. Y. Hung, S. Y. Chiang, C. J. Huang, Chang-Chun Lee, Kuo-Ning Chiang
2007 J jnl
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure.
Microelectron. Reliab.
C. C. Chiu, H. H. Chang, Chang-Chun Lee, C. C. Hsia, Kuo-Ning Chiang
2007 J jnl
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.
Microelectron. Reliab.
Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang
2006 J jnl
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect.
Microelectron. Reliab.
Robin C. J. Wang, Chang-Chun Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao