| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | B | conf |
TrustCom
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2023 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2022 | C | conf |
ICCC
|
| 2022 | J | jnl |
IEEE Trans. Commun.
|
| 2022 | J | jnl |
Deep Pansharpening via 3D Spectral Super-Resolution Network and Discrepancy-Based Gradient Transfer.
Remote. Sens.
|
| 2022 | J | jnl |
IEEE Trans. Commun.
|
| 2021 | — | conf |
ICCT
|
| 2021 | J | jnl |
CoRR
|
| 2021 | — | conf |
ICCT
|
| 2021 | J | jnl |
CoRR
|
| 2021 | B | conf |
ISIT
|
| 2020 | — | conf |
ICCT
|
| 2020 | — | conf |
ICCCS
|
| 2020 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2019 | — | conf |
WOCC
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
WOCC
|
| 2018 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2017 | — | conf |
WCSP
|
| 2016 | — | conf |
ChinaCom (1)
|
| 2016 | — | conf |
ChinaCom (1)
|
| 2016 | Misc | conf |
ICCS
|