Carl V. Thompson

11 papers Journal 6Unranked 5
YearRankTypeTitle / Venue / Authors
2018 J jnl
Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.
Microelectron. Reliab.
Wardhana A. Sasangka, Yu Gao, Chee Lip Gan, Carl V. Thompson
2017 J jnl
Characterisation of defects generated during constant current InGaN-on-silicon LED operation.
Microelectron. Reliab.
Riko I. Made, Yu Gao, Govindo J. Syaranamual, Wardhana A. Sasangka, L. Zhang, Xuan Sang Nguyen, Yee Yan Tay, Jason Scott Herrin, Carl V. Thompson, Chee Lip Gan
2017 J jnl
Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation.
Microelectron. Reliab.
Wardhana A. Sasangka, Govindo J. Syaranamual, Y. Gao, Riko I. Made, Chee Lip Gan, Carl V. Thompson
2016 J jnl
Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation.
Microelectron. Reliab.
Govindo J. Syaranamual, Wardhana A. Sasangka, Riko I. Made, Subramaniam Arulkumaran, Geok Ing Ng, Siew Chuen Foo, Chee Lip Gan, Carl V. Thompson
2015 — conf
Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing.
IRPS
Wardhana A. Sasangka, Govindo J. Syaranamual, Chee Lip Gan, Carl V. Thompson
2007 J jnl
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.
Microelectron. J.
Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
2005 — conf
Electromigration Reliability Comparison of Cu and Al Interconnects.
ISQED
Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
2005 — conf
Thermal aware cell-based full-chip electromigration reliability analysis.
ACM Great Lakes Symposium on VLSI
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
2004 — conf
Circuit Level Reliability Analysis of Cu Interconnects.
ISQED
Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
2002 — conf
A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits.
ISQED
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
1999 J jnl
Methodology for electromigration critical threshold design rule evaluation.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
J. Joseph Clement, Stefan P. Riege, Radenko Cvijetic, Carl V. Thompson
redb/extractors/pe_extractors/__init__.py
← Index redb/extractors/pe_extractors/__init__.py python 
from .pe_resources import PEResourceExtractor
from .pe_sections import PESectionExtractor
from .pe_imports import PEImportExtractor
from .pe_inconsistency_tests import PEInconstistencyTestsExtractor
from .pe_signature import PESignatureExtractor
from .pe_features import PEFeaturesExtractor
from .pe_dotnet import PEDotNetExtractor
from .pe_overlay import PEOverlayExtractor
from .pe_extra_findings import PEExtraFindings