Carl V. Thompson

11 papers Journal 6Unranked 5

Year	Rank	Type	Title / Venue / Authors
2018	J	`jnl`	Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors. Microelectron. Reliab. Wardhana A. Sasangka, Yu Gao, Chee Lip Gan, Carl V. Thompson
2017	J	`jnl`	Characterisation of defects generated during constant current InGaN-on-silicon LED operation. Microelectron. Reliab. Riko I. Made, Yu Gao, Govindo J. Syaranamual, Wardhana A. Sasangka, L. Zhang, Xuan Sang Nguyen, Yee Yan Tay, Jason Scott Herrin, Carl V. Thompson, Chee Lip Gan
2017	J	`jnl`	Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation. Microelectron. Reliab. Wardhana A. Sasangka, Govindo J. Syaranamual, Y. Gao, Riko I. Made, Chee Lip Gan, Carl V. Thompson
2016	J	`jnl`	Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation. Microelectron. Reliab. Govindo J. Syaranamual, Wardhana A. Sasangka, Riko I. Made, Subramaniam Arulkumaran, Geok Ing Ng, Siew Chuen Foo, Chee Lip Gan, Carl V. Thompson
2015	—	`conf`	Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing. IRPS Wardhana A. Sasangka, Govindo J. Syaranamual, Chee Lip Gan, Carl V. Thompson
2007	J	`jnl`	Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. Microelectron. J. Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
2005	—	`conf`	Electromigration Reliability Comparison of Cu and Al Interconnects. ISQED Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
2005	—	`conf`	Thermal aware cell-based full-chip electromigration reliability analysis. ACM Great Lakes Symposium on VLSI Syed M. Alam, Donald E. Troxel, Carl V. Thompson
2004	—	`conf`	Circuit Level Reliability Analysis of Cu Interconnects. ISQED Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel
2002	—	`conf`	A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits. ISQED Syed M. Alam, Donald E. Troxel, Carl V. Thompson
1999	J	`jnl`	Methodology for electromigration critical threshold design rule evaluation. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. J. Joseph Clement, Stefan P. Riege, Radenko Cvijetic, Carl V. Thompson