Caleb Serafy

17 papers A* 1A 2Misc 1Journal 7Unranked 6
YearRankTypeTitle / Venue / Authors
2019 J jnl
Enhanced Phase-Driven Q-Learning-Based DRM for Multicore Processors.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava
2017 — conf
Design Space Modeling and Simulation for Physically Constrained 3D CPUs.
ACM Great Lakes Symposium on VLSI
Caleb Serafy, Zhiyuan Yang, Ankur Srivastava
2017 A* conf
Phase-driven Learning-based Dynamic Reliability Management For Multi-core Processors.
DAC
Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava
2017 J jnl
TSV-Based 3-D ICs: Design Methods and Tools.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava
2016 Misc conf
ECO Based Placement and Routing Framework for 3D FPGAs with Micro-fluidic Cooling.
FCCM
Zhiyuan Yang, Caleb Serafy, Ankur Srivastava
2016 J jnl
Security and Vulnerability Implications of 3D ICs.
IEEE Trans. Multi Scale Comput. Syst.
Yang Xie, Chongxi Bao, Caleb Serafy, Tiantao Lu, Ankur Srivastava, Mark Tehranipoor
2016 J jnl
Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks.
IEEE Des. Test
Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi
2016 J jnl
Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling.
IEEE Trans. Very Large Scale Integr. Syst.
Caleb Serafy, Avram Bar-Cohen, Ankur Srivastava, Donald Yeung
2016 A conf
Voltage Noise Induced DRAM Soft Error Reduction Technique for 3D-CPUs.
ISLPED
Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Ankur Srivastava
2015 J jnl
TSV Replacement and Shield Insertion for TSV-TSV Coupling Reduction in 3-D Global Placement.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Caleb Serafy, Ankur Srivastava
2014 J jnl
A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs.
Integr.
Caleb Serafy, Bing Shi, Ankur Srivastava
2014 — conf
Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts.
ISPD
Caleb Serafy, Ankur Srivastava
2014 A conf
Unlocking the true potential of 3D CPUs with micro-fluidic cooling.
ISLPED
Caleb Serafy, Ankur Srivastava, Donald Yeung
2013 — conf
Co-optimization of TSV assignment and micro-channel placement for 3D-ICs.
ACM Great Lakes Symposium on VLSI
Bing Shi, Caleb Serafy, Ankur Srivastava
2013 — conf
Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs.
ACM Great Lakes Symposium on VLSI
Caleb Serafy, Bing Shi, Ankur Srivastava
2013 — conf
High performance 3D stacked DRAM processor architectures with micro-fluidic cooling.
3DIC
Caleb Serafy, Bing Shi, Ankur Srivastava, Donald Yeung
2013 — conf
Online TSV health monitoring and built-in self-repair to overcome aging.
DFTS
Caleb Serafy, Ankur Srivastava