C. T. Wu - RankMe

Year	Rank	Type	Title / Venue / Authors
2026	J	`jnl`	Systematic Performance Assessment of Deep Material Networks for Multiscale Material Modeling. CoRR Xiaolong He, Haoyan Wei, Wei Hu, Henan Mao, C. T. Wu
2025	J	`jnl`	A GPU-Accelerated Three-Dimensional Crack Element Method for Transient Dynamic Fracture Simulation. CoRR Yuxi Xie, C. T. Wu, Wei Hu, Lu Xu, Tinh Q. Bui, Shaofan Li
2025	—	`conf`	Monolithic 3D Macro Integrating CMOS with Ambipolar SONOS Tunnel FET for High Performance Edge-AI Computing Applications. IMW P. H. Tseng, F. M. Lee, C. C. Yang, H. W. Chiang, C. T. Huang, Y. H. Lin, Yu-Yu Lin, N. C. Lin, P. J. Sung, C. T. Wu, W. F. Wu, C. H. Shen, T. H. Hou, A. Y. Wu, H. Y. Cheng, T. H. Yeh, M. H. Lee, K. Y. Hsieh
2024	J	`jnl`	A novel hypergraph convolution network for wafer defect patterns identification based on an unbalanced dataset. J. Intell. Manuf. Yuxi Xie, Shaofan Li, C. T. Wu, Zhipeng Lai, Miao Su
2020	J	`jnl`	An h-adaptive meshfree-enriched finite element method based on convex approximations for the three-dimensional ductile crack propagation simulation. Comput. Aided Geom. Des. Bo Ren, C. T. Wu, Dandan Lyu
2019	J	`jnl`	Exploring the 3D architectures of deep material network in data-driven multiscale mechanics. CoRR Zeliang Liu, C. T. Wu
2018	J	`jnl`	A Deep Material Network for Multiscale Topology Learning and Accelerated Nonlinear Modeling of Heterogeneous Materials. CoRR Zeliang Liu, C. T. Wu, M. Koishi
2016	J	`jnl`	Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectron. Reliab. Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu
2015	J	`jnl`	Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. Microelectron. Reliab. Ming-Yi Tsai, P. S. Huang, C. H. Lin, C. T. Wu, S. C. Hu
2001	—	`conf`	Building Web Applications Using Java 2 Enterprise Edition. TOOLS (39) C. T. Wu
1987	—	`conf`	Towards fully-computerized database maintenance for non-traditional appliances. FJCC C. T. Wu

Year

Rank

Type

Title / Venue / Authors

2026

jnl

Systematic Performance Assessment of Deep Material Networks for Multiscale Material Modeling.

CoRR

Xiaolong He, Haoyan Wei, Wei Hu, Henan Mao, C. T. Wu

2025

jnl

A GPU-Accelerated Three-Dimensional Crack Element Method for Transient Dynamic Fracture Simulation.

CoRR

Yuxi Xie, C. T. Wu, Wei Hu, Lu Xu, Tinh Q. Bui, Shaofan Li

2025

—

conf

Monolithic 3D Macro Integrating CMOS with Ambipolar SONOS Tunnel FET for High Performance Edge-AI Computing Applications.

IMW

P. H. Tseng, F. M. Lee, C. C. Yang, H. W. Chiang, C. T. Huang, Y. H. Lin, Yu-Yu Lin, N. C. Lin, P. J. Sung, C. T. Wu, W. F. Wu, C. H. Shen, T. H. Hou, A. Y. Wu, H. Y. Cheng, T. H. Yeh, M. H. Lee, K. Y. Hsieh

2024

jnl

A novel hypergraph convolution network for wafer defect patterns identification based on an unbalanced dataset.

J. Intell. Manuf.

Yuxi Xie, Shaofan Li, C. T. Wu, Zhipeng Lai, Miao Su

2020

jnl

An h-adaptive meshfree-enriched finite element method based on convex approximations for the three-dimensional ductile crack propagation simulation.

Comput. Aided Geom. Des.

Bo Ren, C. T. Wu, Dandan Lyu

2019

jnl