Boris Vaisband

33 papers A* 1C 7Journal 11Unranked 12

Year	Rank	Type	Title / Venue / Authors
2025	—	`conf`	Behavioral Model of Charge-Trap Transistors for Neuromorphic Systems. ISQED Ataollah Saeed Monir, Navid Rezazadeh, John Gosson, Boris Vaisband
2025	J	`jnl`	Chiplets Interface Protocol (ChIP) for Ultra-Large-Scale Applications. IEEE J. Emerg. Sel. Topics Circuits Syst. Arvin Delavari, Boris Vaisband
2025	—	`conf`	Graph-Based Timing Prediction at Early-Stage RTL Using Large Language Model. ASP-DAC Fahad Rahman Amik, Yousef Safari, Zhanguang Zhang, Boris Vaisband
2025	—	`conf`	Invited: Chiplet-Based Integration - Scale-Down and Scale-Out. ISPD Boris Vaisband
2025	—	`ed.`	Proceedings of the Great Lakes Symposium on VLSI 2025, GLSVLSI 2025, New Orleans, LA, USA, 30 June 2025 - 2 July 2025 ACM Great Lakes Symposium on VLSI Lu Peng, Boris Vaisband, Fan Chen, Peipei Zhou, Shahar Kvatinsky, Jiafeng Xie
2025	J	`jnl`	Thermal Simulator for Advanced Packaging and Chiplet-Based Systems. IEEE Trans. Very Large Scale Integr. Syst. Yousef Safari, Adam Corbier, Dima Al Saleh, Fahad Rahman Amik, Boris Vaisband
2024	—	`conf`	Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms. ACM Great Lakes Symposium on VLSI Yousef Safari, Yushu Zhao, Boris Vaisband
2024	—	`ed.`	Proceedings of the Great Lakes Symposium on VLSI 2024, GLSVLSI 2024, Clearwater, FL, USA, June 12-14, 2024 ACM Great Lakes Symposium on VLSI Inna Partin-Vaisband, Srinivas Katkoori, Lu Peng, Boris Vaisband, Tooraj Nikoubin
2023	J	`jnl`	A Robust Integrated Power Delivery Methodology for 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. Yousef Safari, Boris Vaisband
2023	J	`jnl`	CTT-Based Scalable Neuromorphic Architecture. IEEE J. Emerg. Sel. Topics Circuits Syst. Mousa Karimi, Ataollah Saeed Monir, Rezvan Mohammadrezaee, Boris Vaisband
2023	—	`conf`	Digital LIF Neuron for CTT-Based Neuromorphic Systems. ACM Great Lakes Symposium on VLSI Okyanus T. Gumus, Mousa Karimi, Boris Vaisband
2023	A*	`conf`	Hybrid Obfuscation of Chiplet-Based Systems. DAC Yousef Safari, Pooya Aghanoury, Subramanian S. Iyer, Nader Sehatbakhsh, Boris Vaisband
2023	—	`conf`	P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs. SOCC Dima Al Saleh, Yousef Safari, Fahad Rahman Amik, Boris Vaisband
2023	—	`conf`	Statistical Weight Refresh System for CTT-Based Synaptic Arrays. ACM Great Lakes Symposium on VLSI Samuel Dayo, Ataollah Saeed Monir, Mousa Karimi, Boris Vaisband
2022	J	`jnl`	A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source. IEEE Access Mousa Karimi, Mohamed Ali, Ahmad Hassan, Reza Bostani, Boris Vaisband, Mohamad Sawan, Benoit Gosselin
2022	—	`conf`	Integrated Power Delivery Methodology for 3D ICs. ISQED Yousef Safari, Boris Vaisband
2022	C	`conf`	Power Delivery for Ultra-Large-Scale Applications on Si-IF. ISCAS Yousef Safari, Anja Kroon, Boris Vaisband
2022	J	`jnl`	Power Delivery for Ultra-Large-Scale Applications on Si-IF. CoRR Yousef Safari, Anja Kroon, Boris Vaisband
2021	C	`conf`	Power Delivery for Silicon Interconnect Fabric. ISCAS Yousef Safari, Boris Vaisband
2020	C	`conf`	Multi-Bit CNT TSV for 3-D ICs. ISCAS Boris Vaisband, Ange Maurice, Chong Wei Tan, Beng Kang Tay, Eby G. Friedman
2019	—	`conf`	Communication Considerations for Silicon Interconnect Fabric. SLIP Boris Vaisband, Subramanian S. Iyer
2019	—	`conf`	Global and semi-global communication on Si-IF. NOCS Boris Vaisband, Subramanian S. Iyer
2019	—	`conf`	Reliability Evaluation of Silicon Interconnect Fabric Technology. IRPS Kannan K. Thankappan, Adeel Ahmad Bajwa, Boris Vaisband, SivaChandra Jangam, Subramanian S. Iyer
2019	J	`jnl`	Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems. IBM J. Res. Dev. Subramanian S. Iyer, SivaChandra Jangam, Boris Vaisband
2018	J	`jnl`	Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems. Future Gener. Comput. Syst. Boris Vaisband, Eby G. Friedman
2018	—	`conf`	Network on interconnect fabric. ISQED Boris Vaisband, Adeel Ahmad Bajwa, Subramanian S. Iyer
2017	J	`jnl`	Hexagonal TSV Bundle Topology for 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs Boris Vaisband, Eby G. Friedman
2017	C	`conf`	Hybrid energy harvesting in 3-D IC IoT devices. ISCAS Boris Vaisband, Eby G. Friedman
2016	C	`conf`	Layer ordering to minimize TSVs in heterogeneous 3-D ICs. ISCAS Boris Vaisband, Eby G. Friedman
2016	J	`jnl`	Noise Coupling Models in Heterogeneous 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. Boris Vaisband, Eby G. Friedman
2015	C	`conf`	3-D floorplanning algorithm to minimize thermal interactions. ISCAS Boris Vaisband, Eby G. Friedman
2015	J	`jnl`	Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits. IEEE Trans. Very Large Scale Integr. Syst. Ioannis Savidis, Boris Vaisband, Eby G. Friedman
2014	C	`conf`	Thermal conduction path analysis in 3-D ICs. ISCAS Boris Vaisband, Ioannis Savidis, Eby G. Friedman