| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
Int. J. Hum. Comput. Interact.
|
| 2025 | J | jnl |
J. Signal Process. Syst.
|
| 2025 | A* | conf |
VR
|
| 2025 | — | conf |
VR Workshops
|
| 2025 | J | jnl |
J. Cloud Comput.
|
| 2025 | — | conf |
VR Workshops
|
| 2025 | J | jnl |
Inf. Fusion
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
SIGIR Forum
|
| 2024 | J | jnl |
IEEE Trans. Hum. Mach. Syst.
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2024 | — | conf |
IEEE SENSORS
|
| 2024 | B | conf |
COMPSAC
|
| 2024 | B | conf |
COMPSAC
|
| 2024 | J | jnl |
IEEE Signal Process. Lett.
|
| 2024 | J | jnl |
Adv. Intell. Syst.
|
| 2024 | B | conf |
CEC
|
| 2024 | — | conf |
ICPR (25)
|
| 2024 | B | conf |
COMPSAC
|
| 2024 | J | jnl |
Sensors
|
| 2023 | J | jnl |
Intell. Syst. Appl.
|
| 2023 | C | conf |
TENCON
|
| 2023 | — | conf |
IHCI (2)
|
| 2023 | — | conf |
Deep Learning Approach for Enhanced Object Recognition and Assembly Guidance with Augmented Reality.
IHCI (2)
|
| 2023 | J | jnl |
Sensors
|
| 2023 | — | conf |
TALE
|
| 2023 | — | conf |
SENSORS
|
| 2023 | — | conf |
TALE
|
| 2023 | C | conf |
IECON
|
| 2023 | — | conf |
EMBC
|
| 2023 | — | conf |
CSCN
|
| 2023 | — | conf |
SENSORS
|
| 2023 | — | conf |
IHCI (1)
|
| 2023 | — | conf |
IHCI (2)
|
| 2023 | — | conf |
IHCI (2)
|
| 2022 | J | jnl |
IEEE Open J. Commun. Soc.
|
| 2022 | J | jnl |
SN Comput. Sci.
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2022 | — | conf |
IEEE SENSORS
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
SN Comput. Sci.
|
| 2021 | — | conf |
ICHI
|
| 2021 | J | jnl |
Sensors
|
| 2021 | — | conf |
ICHI
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Sensors
|
| 2020 | J | jnl |
Sensors
|
| 2020 | — | conf |
IHCI (1)
|
| 2018 | J | jnl |
Sensors
|
| 2017 | — | conf |
BDIOT
|
| 2017 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2017 | J | jnl |
IEEE Trans. Hum. Mach. Syst.
|
| 2015 | — | conf |
EMBC
|
| 2014 | J | jnl |
Sensors
|
| 2012 | J | jnl |
Sensors
|
| 2011 | J | jnl |
IET Commun.
|