Bon Woong Ku - RankMe

21 papers A* 3A 6B 1Journal 4Unranked 6

Year	Rank	Type	Title / Venue / Authors
2022	J	`jnl`	Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Heechun Park, Bon Woong Ku, Sukeshwar Kannan, Krishnendu Chakrabarty, Sung Kyu Lim
2022	J	`jnl`	Unsupervised Digit Recognition Using Cosine Similarity In A Neuromemristive Competitive Learning System. ACM J. Emerg. Technol. Comput. Syst. Bon Woong Ku, Catherine D. Schuman, Md Musabbir Adnan, Tiffany M. Mintz, Raphael C. Pooser, Kathleen E. Hamilton, Garrett S. Rose, Sung Kyu Lim
2021	—	`conf`	ML-Based Wire RC Prediction in Monolithic 3D ICs with an Application to Full-Chip Optimization. ISPD Sai Surya Kiran Pentapati, Bon Woong Ku, Sung Kyu Lim
2021	J	`jnl`	Pseudo-3D Physical Design Flow for Monolithic 3D ICs: Comparisons and Enhancements. ACM Trans. Design Autom. Electr. Syst. Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim
2020	J	`jnl`	Compact-2D: A Physical Design Methodology to Build Two-Tier Gate-Level 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim
2020	A	`conf`	Pin-in-the-middle: an efficient block pin assignment methodology for block-level monolithic 3D ICs. ISLPED Bon Woong Ku, Sung Kyu Lim
2020	—	`conf`	Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool Flow Targeting Monolithic 3D ICs. ISPD Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim
2019	B	`conf`	Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs. ETS Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, Sung Kyu Lim
2019	—	`—`	Physical design solutions for 3D ICs and their neuromorphic applications. Bon Woong Ku
2019	A*	`conf`	RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs. DAC Heechun Park, Kyungwook Chang, Bon Woong Ku, Jinwoo Kim, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Saibal Mukhopadhyay, Krishnendu Chakrabarty, Sung Kyu Lim
2018	—	`conf`	A Twin Memristor Synapse for Spike Timing Dependent Learning in Neuromorphic Systems. SoCC Md Musabbir Adnan, Sagarvarma Sayyaparaju, Garrett S. Rose, Catherine D. Schuman, Bon Woong Ku, Sung Kyu Lim
2018	A	`conf`	Area-efficient and low-power face-to-face-bonded 3D liquid state machine design. ICCAD Bon Woong Ku, Yu Liu, Yingyezhe Jin, Peng Li, Sung Kyu Lim
2018	—	`conf`	Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs. ISPD Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim
2018	A*	`conf`	Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor. DAC Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim
2017	—	`conf`	Evaluating online-learning in memristive neuromorphic circuits. NCS Austin Wyer, Md Musabbir Adnan, Bon Woong Ku, Sung Kyu Lim, Catherine D. Schuman, Raphael C. Pooser, Garrett S. Rose
2017	A	`conf`	Full-chip monolithic 3D IC design and power performance analysis with ASAP7 library: (Invited Paper). ICCAD Kyungwook Chang, Bon Woong Ku, Saurabh Sinha, Sung Kyu Lim
2017	A	`conf`	Transistor-level monolithic 3D standard cell layout optimization for full-chip static power integrity. ISLPED Bon Woong Ku, Taigon Song, Arthur Nieuwoudt, Sung Kyu Lim
2016	A	`conf`	How much cost reduction justifies the adoption of monolithic 3D ICs at 7nm node? ICCAD Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Sung Kyu Lim
2016	—	`conf`	Monolithic 3D IC design: Power, performance, and area impact at 7nm. ISQED Kartik Acharya, Kyungwook Chang, Bon Woong Ku, Shreepad Panth, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim
2016	A	`conf`	Physical Design Solutions to Tackle FEOL/BEOL Degradation in Gate-level Monolithic 3D ICs. ISLPED Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Diederik Verkest, Aaron Thean, Sung Kyu Lim
2015	A*	`conf`	Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM. DAC Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim