| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2026 | J | jnl |
Appl. Soft Comput.
|
| 2026 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | — | conf |
ICIRA (1)
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ICIRA (3)
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
Inf. Fusion
|
| 2025 | J | jnl |
IEEE Trans. Robotics
|
| 2025 | — | conf |
ICIRA (1)
|
| 2025 | — | conf |
ICIRA (2)
|
| 2025 | J | jnl |
Incremental transfer learning for robot drilling state monitoring under multiple working conditions.
J. Intell. Manuf.
|
| 2025 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2025 | J | jnl |
Neural Comput. Appl.
|
| 2025 | J | jnl |
Pattern Recognit.
|
| 2025 | — | conf |
WF-IoT
|
| 2025 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2024 | — | conf |
ICIRA (2)
|
| 2024 | — | conf |
ROBIO
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Knowl. Based Syst.
|
| 2024 | — | conf |
ICIRA (7)
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Int. J. Intell. Robotics Appl.
|
| 2024 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2024 | C | conf |
IECON
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2024 | J | jnl |
Int. J. Intell. Robotics Appl.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2024 | — | conf |
ICIRA (1)
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | — | conf |
ICIRA (8)
|
| 2024 | — | conf |
ICIRA (8)
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Inf. Fusion
|
| 2024 | — | conf |
RCAR
|
| 2023 | C | conf |
IECON
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | — | conf |
ICIRA (6)
|
| 2023 | — | conf |
RCAR
|
| 2023 | — | conf |
RCAR
|
| 2023 | — | conf |
ROBIO
|
| 2023 | — | conf |
RCAR
|
| 2023 | — | conf |
ICIRA (5)
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | C | conf |
IECON
|
| 2023 | — | conf |
ICIRA (6)
|
| 2023 | — | conf |
ICIRA (7)
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
ICIRA (3)
|
| 2021 | — | conf |
ICIRA (3)
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2021 | — | conf |
M2VIP
|
| 2021 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2021 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2021 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2021 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2021 | J | jnl |
Inf. Sci.
|
| 2021 | J | jnl |
Pattern Recognit.
|
| 2021 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2020 | — | conf |
RCAR
|
| 2020 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2020 | J | jnl |
Neurocomputing
|
| 2020 | J | jnl |
Frontiers Neurorobotics
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2020 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2019 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2019 | — | conf |
CAA SAFEPROCESS
|
| 2019 | — | conf |
AIM
|
| 2019 | — | conf |
ICIRA (6)
|
| 2019 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2019 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2018 | — | conf |
ICIRA (1)
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2017 | — | conf |
ICIRA (3)
|
| 2016 | — | conf |
ICIRA (1)
|
| 2014 | — | conf |
NEMS
|
| 2013 | — | conf |
Mechanical stability analysis of organic thin film transistors considering interfacial delamination.
NEMS
|
| 2013 | J | jnl |
Microelectron. Reliab.
|
| 2012 | — | conf |
ICIRA (1)
|
| 2008 | — | conf |
ICIRA (2)
|
| 2007 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2006 | J | jnl |
Microelectron. Reliab.
|
| 2003 | B | conf |
SMC
|