| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Digit. Signal Process.
|
| 2026 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2025 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Knowl. Inf. Syst.
|
| 2024 | J | jnl |
Sensors
|
| 2023 | C | conf |
SAFEPROCESS
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
CCIS
|
| 2022 | J | jnl |
Complex.
|
| 2022 | — | conf |
AIAM
|
| 2020 | J | jnl |
A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Comput. Electron. Agric.
|
| 2020 | J | jnl |
Sci. China Inf. Sci.
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2017 | J | jnl |
J. Intell. Manuf.
|
| 2017 | J | jnl |
Microelectron. Reliab.
|
| 2016 | — | conf |
VTC Spring
|
| 2015 | J | jnl |
Int. J. Distributed Sens. Networks
|
| 2011 | J | jnl |
J. Comput. Chem.
|
| 2010 | J | jnl |
J. Comput. Chem.
|
| 2007 | — | conf |
CSCWD (Selected Papers)
|
| 2007 | C | conf |
CSCWD
|
| 2005 | — | conf |
CSCWD (1)
|