| 2026 |
J |
jnl |
CoRR
Binglei Lou, Haoran Wu, Yao Lai, Jiayi Nie, Can Xiao, Xuan Guo, Rika Antonova, Robert Mullins, Aaron Zhao
|
| 2026 |
J |
jnl |
CoRR
Binglei Lou, Ruilin Wu, Philip Leong
|
| 2026 |
J |
jnl |
CoRR
Jiayi Nie, Haoran Wu, Yao Lai, Zeyu Cao, Cheng Zhang, Binglei Lou, Erwei Wang, Jianyi Cheng, Timothy M. Jones, Robert Mullins, Rika Antonova, Yiren Zhao
|
| 2025 |
J |
jnl |
CoRR
Haoran Wu, Can Xiao, Jiayi Nie, Xuan Guo, Binglei Lou, Jeffrey T. H. Wong, Zhiwen Mo, Cheng Zhang, Przemyslaw Forys, Wayne Luk, Hongxiang Fan, Jianyi Cheng, Timothy M. Jones, Rika Antonova, Robert Mullins, Aaron Zhao
|
| 2025 |
J |
jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Chuliang Guo, Binglei Lou, David Boland, Philip H. W. Leong
|
| 2025 |
J |
jnl |
CoRR
Binglei Lou, Gautham Duddi Krishnaswaroop, Filip Wojcicki, Ruilin Wu, Richard Rademacher, Zhiqiang Que, Wayne Luk, Philip H. W. Leong
|
| 2025 |
Misc |
conf |
FCCM
Binglei Lou, Ruilin Wu, Philip Leong
|
| 2025 |
J |
jnl |
CoRR
Binglei Lou, Ruilin Wu, Philip Leong
|
| 2024 |
B |
conf |
FPL
Binglei Lou, Richard Rademacher, David Boland, Philip H. W. Leong
|
| 2024 |
J |
jnl |
CoRR
Binglei Lou, Richard Rademacher, David Boland, Philip H. W. Leong
|
| 2024 |
J |
jnl |
CoRR
Binglei Lou, David Boland, Philip H. W. Leong
|
| 2023 |
A |
conf |
ICCAD
Chuliang Guo, Binglei Lou, Xueyuan Liu, David Boland, Philip H. W. Leong, Cheng Zhuo
|
| 2023 |
J |
jnl |
ACM Trans. Reconfigurable Technol. Syst.
Carol Jingyi Li, Xiangwei Li, Binglei Lou, Craig T. Jin, David Boland, Philip H. W. Leong
|
| 2023 |
A |
conf |
FPGA
Chuliang Guo, Binglei Lou, Xueyuan Liu, David Boland, Philip H. W. Leong
|
| 2023 |
J |
jnl |
ACM Trans. Reconfigurable Technol. Syst.
Binglei Lou, David Boland, Philip H. W. Leong
|
| 2019 |
J |
jnl |
Microelectron. J.
Fangfa Fu, Binglei Lou, Yukun Chen, Jinxiang Wang
|
| 2018 |
— |
conf |
PCM (2)
Weizhe Xu, Fangfa Fu, Binglei Lou, Yao Wang, Jinxiang Wang
|