| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2026 | J | jnl |
Math. Comput. Simul.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
IEEE Trans. Neural Networks Learn. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Comput. Methods Programs Biomed.
|
| 2025 | J | jnl |
IEEE Trans. Intell. Veh.
|
| 2025 | — | conf |
ICECS
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
ACM Journal on Computing and Cultural Heritage
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | — | conf |
OFC
|
| 2025 | J | jnl |
Comput. Hum. Behav.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2024 | — | conf |
BCB
|
| 2024 | J | jnl |
J. Electronic Imaging
|
| 2024 | J | jnl |
J. Electronic Imaging
|
| 2024 | — | conf |
CIS-RAM
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2024 | — | conf |
L4DC
|
| 2024 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
Vis. Comput.
|
| 2023 | J | jnl |
Vis. Comput.
|
| 2023 | J | jnl |
J. Electronic Imaging
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | — | conf |
CASE
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | — | conf |
ITSC
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | — | conf |
ITSC
|
| 2022 | J | jnl |
Adv. Intell. Syst.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | — | conf |
EMBC
|
| 2022 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2022 | — | conf |
BIC-TA
|
| 2022 | J | jnl |
J. Electronic Imaging
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | — | conf |
ITSC
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | — | conf |
ICTA
|
| 2021 | J | jnl |
Sci. China Inf. Sci.
|
| 2021 | — | conf |
DTPI
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2021 | J | jnl |
BMC Bioinform.
|
| 2020 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | A* | conf |
ICRA
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2020 | — | conf |
Image Processing: Algorithms and Systems
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | C | conf |
FUSION
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
J. Frankl. Inst.
|
| 2019 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | J | jnl |
IEEE Access
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2016 | J | jnl |
Int. J. Syst. Sci.
|
| 2013 | B | conf |
ICIP
|
| 2009 | C | conf |
IEA/AIE
|
| 2005 | — | conf |
SKG
|