Bing Shi

21 papers A* 1A 1Journal 8Unranked 10
YearRankTypeTitle / Venue / Authors
2014 J jnl
A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs.
Integr.
Caleb Serafy, Bing Shi, Ankur Srivastava
2014 J jnl
Optimized Micro-Channel Design for Stacked 3-D-ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Bing Shi, Ankur Srivastava
2014 J jnl
Statistical Framework for Designing On-Chip Thermal Sensing Infrastructure in Nanoscale Systems.
IEEE Trans. Very Large Scale Integr. Syst.
Yufu Zhang, Bing Shi, Ankur Srivastava
2013 J jnl
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit.
IET Circuits Devices Syst.
Bing Shi, Ankur Srivastava, Avram Bar-Cohen
2013 — conf
Co-optimization of TSV assignment and micro-channel placement for 3D-ICs.
ACM Great Lakes Symposium on VLSI
Bing Shi, Caleb Serafy, Ankur Srivastava
2013 J jnl
Dynamic Thermal Management Under Soft Thermal Constraints.
IEEE Trans. Very Large Scale Integr. Syst.
Bing Shi, Yufu Zhang, Ankur Srivastava
2013 — conf
Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs.
ACM Great Lakes Symposium on VLSI
Caleb Serafy, Bing Shi, Ankur Srivastava
2013 — conf
High performance 3D stacked DRAM processor architectures with micro-fluidic cooling.
3DIC
Caleb Serafy, Bing Shi, Ankur Srivastava, Donald Yeung
2013 J jnl
Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design.
Adv. Comput.
Bing Shi, Ankur Srivastava
2013 — conf
Thermal stress aware 3D-IC statistical static timing analysis.
ACM Great Lakes Symposium on VLSI
Bing Shi, Ankur Srivastava
2012 J jnl
Accelerating Gate Sizing Using Graphics Processing Units.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Bing Shi, Yufu Zhang, Ankur Srivastava
2012 — conf
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs.
ISVLSI
Bing Shi, Ankur Srivastava, Avram Bar-Cohen
2012 — conf
TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs.
ISPD
Bing Shi, Ankur Srivastava
2012 — ch.
Thermal and Power-Aware Task Scheduling and Data Placement for Storage Centric Datacenters.
Handbook of Energy-Aware and Green Computing
Bing Shi, Ankur Srivastava
2011 — conf
Cooling of 3D-IC using non-uniform micro-channels and sensor based dynamic thermal management.
Allerton
Bing Shi, Ankur Srivastava
2011 — conf
Liquid cooling for 3D-ICs.
IGCC
Bing Shi, Ankur Srivastava
2011 A* conf
Non-uniform micro-channel design for stacked 3D-ICs.
DAC
Bing Shi, Ankur Srivastava, Peng Wang
2011 J jnl
Unified datacenter power management considering on-chip and air temperature constraints.
Sustain. Comput. Informatics Syst.
Bing Shi, Ankur Srivastava
2010 — conf
A statistical framework for designing on-chip thermal sensing infrastructure in nano-scale systems.
ISPD
Yufu Zhang, Bing Shi, Ankur Srivastava
2010 A conf
Dynamic thermal management for single and multicore processors under soft thermal constraints.
ISLPED
Bing Shi, Yufu Zhang, Ankur Srivastava
2010 — conf
Thermal and power-aware task scheduling for Hadoop based storage centric datacenters.
Green Computing Conference
Bing Shi, Ankur Srivastava