Bernhard Wunderle

21 papers Journal 17Unranked 4
YearRankTypeTitle / Venue / Authors
2025 J jnl
Synthetic data generation using finite element method to pre-train an image segmentation model for defect detection using infrared thermography.
J. Intell. Manuf.
Kaushal Arun Pareek, Daniel May, Peter Meszmer, Mohamad Abo Ras, Bernhard Wunderle
2024 J jnl
Precise Adverse Weather Characterization by Deep-Learning-Based Noise Processing in Automotive LiDAR Sensors.
Remote. Sens.
Marcel Kettelgerdes, Nicolas Sarmiento, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger
2023 J jnl
Accelerated Real-Life (ARL) Testing and Characterization of Automotive LiDAR Sensors to facilitate the Development and Validation of Enhanced Sensor Models.
CoRR
Marcel Kettelgerdes, Tjorven Hillmann, Thomas Hirmer, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger
2023 — conf
Automotive LiDAR Based Precipitation State Estimation Using Physics Informed Spatio-Temporal 3D Convolutional Neural Networks (PIST-CNN).
M2VIP
Marcel Kettelgerdes, Amit Pandey, Denis Unruh, Hüseyin Erdogan, Bernhard Wunderle, Gordon Elger
2022 J jnl
Collaborative Filler Network for Enhancing the Performance of BaTiO3/PDMS Flexible Piezoelectric Polymer Composite Nanogenerators.
Sensors
Ayda Bouhamed, Nathanael Jöhrmann, Slim Naifar, Benny Böhm, Olav Hellwig, Bernhard Wunderle, Olfa Kanoun
2017 J jnl
Location resolved transient thermal analysis to investigate crack growth in solder joints.
Microelectron. Reliab.
E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger
2017 J jnl
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests.
Microelectron. Reliab.
Jens Heilmann, Ivan Nikitin, Uwe Zschenderlein, Daniel May, Klaus Pressel, Bernhard Wunderle
2017 J jnl
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy.
Microelectron. Reliab.
Peter Meszmer, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R. T. Zahn, Bernhard Wunderle
2016 J jnl
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.
Microelectron. Reliab.
Emad A. Poshtan, Sven Rzepka, Christian Silber, Bernhard Wunderle
2016 — conf
Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems.
NEMS
Jens Bonitz, Simon Böttger, Sascha Hermann, Stefan E. Schulz, Thomas Gessner, Steffen Hartmann, Bernhard Wunderle
2014 J jnl
Stress impact of moisture diffusion measured with the stress chip.
Microelectron. Reliab.
Florian Schindler-Saefkow, Florian Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Jürgen Keller
2013 J jnl
Transport of moisture at epoxy-SiO
Microelectron. Reliab.
O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang
2012 J jnl
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.
Microelectron. Reliab.
O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle
2012 — conf
Nanomechanics of CNTs for sensor application.
SSD
Christian Wagner, Steffen Hartmann, Bernhard Wunderle, Jörg Schuster, Stefan E. Schulz, Thomas Gessner
2011 J jnl
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO
Microelectron. Reliab.
O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel
2010 J jnl
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.
Microelectron. Reliab.
Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl
2009 — conf
3-D thin chip integration technology - from technology development to application.
3DIC
Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl
2007 J jnl
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
Microelectron. Reliab.
Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel
2007 J jnl
Reliability of SnPb and Pb-free flip-chips under different test conditions.
Microelectron. Reliab.
M. Spraul, Wolfgang Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel
2006 J jnl
Progress in reliability research in the micro and nano region.
Microelectron. Reliab.
Bernhard Wunderle, Bernd Michel
2004 J jnl
Parametric FE-approach to flip-chip reliability under various loading conditions.
Microelectron. Reliab.
Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl