Bernd Michel

14 papers Journal 14
YearRankTypeTitle / Venue / Authors
2014 J jnl
On the crack and delamination risk optimization of a Si-interposer for LED packaging.
Microelectron. Reliab.
Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel
2014 J jnl
Stress analyses of high spatial resolution on TSV and BEoL structures.
Microelectron. Reliab.
Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel
2014 J jnl
Stress impact of moisture diffusion measured with the stress chip.
Microelectron. Reliab.
Florian Schindler-Saefkow, Florian Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Jürgen Keller
2013 J jnl
Effect of moisture swelling on MEMS packaging and integrated sensors.
Microelectron. Reliab.
J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel
2012 J jnl
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.
Microelectron. Reliab.
O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle
2012 J jnl
Studies on the reliability of power packages based on strength and fracture criteria.
Microelectron. Reliab.
Rainer Dudek, Reinhard Pufall, Bettina Seiler, Bernd Michel
2011 J jnl
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO
Microelectron. Reliab.
O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel
2010 J jnl
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.
Microelectron. Reliab.
Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl
2009 J jnl
Simulation based analysis of secondary effects on solder fatigue.
Microelectron. Reliab.
Rainer Dudek, Ralf Döring, Christine Bombach, Bernd Michel
2007 J jnl
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
Microelectron. Reliab.
Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel
2007 J jnl
Reliability of SnPb and Pb-free flip-chips under different test conditions.
Microelectron. Reliab.
M. Spraul, Wolfgang Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel
2006 J jnl
Progress in reliability research in the micro and nano region.
Microelectron. Reliab.
Bernhard Wunderle, Bernd Michel
2004 J jnl
Parametric FE-approach to flip-chip reliability under various loading conditions.
Microelectron. Reliab.
Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl
2001 J jnl
Mechanical Reliability of MEMS-structures under shock load.
Microelectron. Reliab.
Ulrich Wagner, J. Franz, M. Schweiker, Winfried Bernhard, Roland Müller-Fiedler, Bernd Michel, Oliver Paul