Bernd Deutschmann

50 papers C 2Journal 24Unranked 24

Year	Rank	Type	Title / Venue / Authors
2026	J	`jnl`	A comparative analysis of DPI and BCI methods for EM immunity of automotive ICs. Elektrotech. Informationstechnik Simon Profanter, Bernd Deutschmann
2025	—	`conf`	Testing the Reliability of 2D MEMS Mirrors by Increasing the Applied Stress Over Time. PRIME Marlene Schneider, David Brunner, Bernd Deutschmann
2024	J	`jnl`	A modular and scalable system for electromagnetic compatibility testing of integrated circuits. Elektrotech. Informationstechnik Daniel Kircher, Simon Profanter, Bernd Deutschmann
2024	J	`jnl`	Bias dependence in statistical random telegraph noise analysis based on nanoscale CMOS ring oscillators. Elektrotech. Informationstechnik Semih Ramazanoglu, Alicja Michalowska-Forsyth, Bernd Deutschmann
2024	—	`conf`	Characterisation of an EMI-Improved Integrated Folded Cascode Amplifier Structure Using the EMIRR Measurement Method. EMC Compo Dominik Zupan, Nikolaus Czepl, Bernd Deutschmann
2024	—	`conf`	EMI Robust Comparator Design for Protection Features of Smart Power Switches. EMC Compo Daniel Kircher, Cristian Ionascu, Bernd Deutschmann
2024	—	`conf`	Effects of Ionizing Radiation on the EMI-Induced Offset Voltage of Operational Amplifiers. EMC Compo Nikolaus Czepl, Dominik Zupan, Alicja Michalowska-Forsyth, Bernd Deutschmann
2024	J	`jnl`	Electromagnetic emission of integrated circuits induced by ionizing radiation and its measurement uncertainties. Elektrotech. Informationstechnik Nikolaus Czepl, Nikolaus Juch, Bernd Deutschmann
2024	—	`conf`	Evaluation of the Electromagnetic Emission of ICs Using Different Spread Spectrum Approaches. EMC Compo Marco Pfeifer, Ko Odreitz, Bernd Deutschmann
2024	J	`jnl`	Influence of the IC power supply and decoupling capacitor arrangement on the electromagnetic emission. Elektrotech. Informationstechnik Bernd Deutschmann, Nikolaus Juch
2024	C	`conf`	WIP: Building an Education Ecosystem for Next Generation Microelectronics Experts in Green and Circular Economy with Digitally-Supported Teaching Methods for Sustainable Chips and Applications (EU Project GreenChips-EDU). FIE Klaus Hofmann, Ferdinand Keil, David Riehl, Alicja Michalowska-Forsyth, Nikolaus Czepl, Sarah Woywod, Dominik Zupan, Mario R. Casu, Carlo Ricciardi, Massimo Violante, Mariagrazia Graziano, Yuri Ardesi, Fabrizio Mo, Dominik Berger, Sabine Sill, Volker Visotschnig, Panagiota Morfouli, Liliana Prejbeanu, Katell Morin-Allory, Cyrille Chavet, Davide Bucci, Skandar Basrour, Jean-Christophe Crebier, Nhu-Huan Nguyen, Ernesto Quisbert-Trujillo, Christian Defélix, Isabelle Corbett-Etchevers, Johannes Sturm, Jens Peter Konrath, Ulla Birnbacher, Thomas Klinger, Wolfgang Werth, Jorge Fernandes, Marcelino B. Santos, Antonio Rubio, Alba Pagès-Zamora, Josep Pegueroles, Jordi Salazar, Beatriz Otero, J. Manuel Moreno, X. Aragones, Israel Martin, Aleix Sole, Dunja Suttnig, Julia Calabro, Floriberto Lima, Eric Jouseau, François Cerisier, Cristian Rivier, Sepp Eisenriegler, Harald Reichl, Miroslav Macan, Dubravko Kruselj, Mladen Puskaric, Mirjana Tatalovic, Vinko Zelenicic, Bernd Deutschmann
2023	—	`conf`	A Sub-100 mV AC/DC Converter with Impedance Matching for Magnetic Field Energy Harvesting. PRIME Harald Dillersberger, Douglas Tham, Bernd Deutschmann
2023	J	`jnl`	Efficient electromagnetic interference modeling of a gallium nitride half bridge. Elektrotech. Informationstechnik Jan Hansen, Bernd Deutschmann
2023	—	`conf`	Framework to Simulate and Analyse the Electromagnetic Emission of Integrated Circuits under Electromagnetic Interference. SMACD Dominik Zupan, Daniel Kircher, Nikolaus Czepl, Bernd Deutschmann
2021	J	`jnl`	Fast and simple model generation for superjunction power MOSFETs. Elektrotech. Informationstechnik Michael Fuchs, Lukas Spielberger, Ko Odreitz, Bernd Deutschmann
2021	J	`jnl`	Leistungselektronik/Leistungshalbleiter - Anwendungen von Milliwatt bis Megawatt, vom Mikrochip bis zum System. Elektrotech. Informationstechnik Bernd Deutschmann
2020	J	`jnl`	Comparison of EMI effects on different current mirror structures using a post-processing framework. Elektrotech. Informationstechnik Dominik Zupan, Bernd Deutschmann
2020	J	`jnl`	EMI-optimized driver for high-frequency boost converter. Elektrotech. Informationstechnik Volha Subotskaya, Emanuele Bodano, Bernd Deutschmann
2020	J	`jnl`	System-level evaluation of dynamic effects in a GaN-based class-E power amplifier. Integr. Andrea Minetto, Bernd Deutschmann, Oliver Häberlen, Gilberto Curatola
2019	—	`conf`	Band Specific Suppression of Harmonics and its Effects on Power Efficiency. PRIME Rahul Nadgouda, Bernd Deutschmann
2019	J	`jnl`	Erratum to: Design and theoretical comparison of input ESD devices in 180 nm CMOS with focus on low capacitance. Elektrotech. Informationstechnik Alicja Michalowska-Forsyth, Patrick Schrey, Bernd Deutschmann
2019	—	`conf`	Identification of EMI Induced Changes During the Design of ICs using a Post-Processing Framework. SMACD Dominik Zupan, Bernd Deutschmann
2019	—	`conf`	Survey on the Generation of Equivalent Circuit Cable Models for Transient Simulation. MIPRO Martin Ibel, Herbert Hackl, Bernhard Auinger, Christian Stockreiter, Bernd Deutschmann
2019	—	`conf`	System-Level Assessment of Dynamic Effects in GaN-based Power Converters. PRIME Andrea Minetto, Bernd Deutschmann, Oliver Häberlen, Gilberto Curatola
2018	—	`conf`	A Temperature Analysis for NFC-Powered Smart Lab-on-Chip Devices. MWSCAS Carolin Kollegger, Christoph Steffan, Philipp Greiner, Clemens Rabl, David Lugitsch, Gerald Holweg, Bernd Deutschmann
2018	J	`jnl`	Design and theoretical comparison of input ESD devices in 180 nm CMOS with focus on low capacitance. Elektrotech. Informationstechnik Alicja Malgorzata Michalowska-Forsyth, Patrick Schrey, Bernd Deutschmann
2018	J	`jnl`	Impact of electromagnetic interference on the functional safety of smart power devices for automotive applications. Elektrotech. Informationstechnik Bernd Deutschmann, Gunter Winkler, Paul Kastner
2018	J	`jnl`	Innovativer HVDC-DC-Wandler für Hochspannungs-Gleichstrom-Netze - Grundsätzliche Überlegungen zu Topologie, Regelung und elektromagnetischer Verträglichkeit. Elektrotech. Informationstechnik Herwig Renner, Uwe Schichler, Klaus Krischan, Bernd Deutschmann, Bernhard Auinger, Martin Horn, Markus Reichhartinger, Franz Vollmaier
2018	J	`jnl`	Intelligent NFC potassium measurement strip with hemolysis check in capillary blood. Elektrotech. Informationstechnik Carolin Kollegger, Philipp Greiner, Inge Siegl, Christoph Steffan, Martin Wiessflecker, Bruna Pekec, Martin Hajnsek, Frank Sinner, Gerald Holweg, Bernd Deutschmann
2018	J	`jnl`	Mikroelektronik aus Österreich - Grundlage für Österreichs Innovations- und Wettbewerbsfähigkeit. Elektrotech. Informationstechnik Bernd Deutschmann
2018	J	`jnl`	Optimized gate driver for high-frequency buck converter. Elektrotech. Informationstechnik Volha Subotskaya, Vratislav Mihal, Mikhail Tulupov, Bernd Deutschmann
2017	—	`conf`	A system-on-chip NFC bicycle tire pressure measurement system. MWSCAS Carolin Kollegger, Philipp Greiner, Christoph Steffan, Martin Wiessflecker, Heiko Froehlich, Thoralf Kautzsch, Gerald Holweg, Bernd Deutschmann
2017	—	`conf`	Autonomous maximum power point tracking algorithm for ultra-low power energy harvesting. MWSCAS Christoph Steffan, Philipp Greiner, Carolin Kollegger, Inge Siegl, Gerald Holweg, Bernd Deutschmann
2016	J	`jnl`	Elektromagnetische Verträglichkeit und Robustheit elektronischer Systeme als Herausforderung des Technologiezeitalters. Elektrotech. Informationstechnik Bernd Deutschmann
2016	J	`jnl`	Highlighting the distribution path of transient disturbances by near field scanning techniques. Elektrotech. Informationstechnik Bernd Deutschmann, Sandra Schindlbacher, Gunter Winkler
2016	J	`jnl`	Intelligent plaster for accurate body temperature monitoring and investigations regarding EMI using near-field magnetic scan. Elektrotech. Informationstechnik Carolin Kollegger, Christoph Steffan, Philipp Greiner, Martin Wiessflecker, Gerald Holweg, Bernd Deutschmann
2016	J	`jnl`	Von der Blitzentladung bis zu ESD-Testverfahren - Beanspruchungen von Geräten und integrierten Schaltungen sowie normative Anforderungen. Elektrotech. Informationstechnik Bernd Deutschmann, Stephan Pack, Gunter Winkler
2015	—	`conf`	Characterization of the immunity of integrated circuits (ICs) at wafer level. EMC Compo Andrea Lavarda, Dominik Amschl, Susanne Bauer, Bernd Deutschmann
2015	—	`conf`	EMI improved chopped operational amplifier. EMC Compo Andrea Lavarda, Bernd Deutschmann
2015	—	`conf`	Emission reduction in Class D audio amplifiers by optimizing spread spectrum modulation. EMC Compo Bernd Deutschmann, Gunter Winkler, Timuçin Karaca
2015	—	`conf`	Energy harvesting with on-chip solar cells and integrated DC/DC converter. ESSDERC Christoph Steffan, Philipp Greiner, Bernd Deutschmann, Carolin Kollegger, Gerald Holweg
2015	—	`conf`	Simulation of radiated emission during the design phase based on scattering parameter measurement. EMC Compo Herbert Hackl, Gunter Winkler, Bernd Deutschmann
2013	—	`conf`	Spread spectrum clocking for emission reduction of charge pump applications. EMC Compo Bernd Deutschmann
2006	—	`conf`	EMV elektronischer Unterbaugruppen und integrierter Schaltkreise im Kraftfahrzeug. EMV Kurt Lamedschwandner, Hans Preineder, Gunter Winkler, Bernd Deutschmann, Timm Ostermann
2006	J	`jnl`	ICs als Quelle der Störemissionen von elektronischen Geräten und Systemen? Elektrotech. Informationstechnik Bernd Deutschmann
2006	J	`jnl`	Vergleichende EMV-Untersuchungen auf Geräte- und IC-Ebene. Elektrotech. Informationstechnik Kurt Lamedschwandner, Bernd Deutschmann, Gunter Winkler, Timm Ostermann
2003	—	`conf`	CMOS output drivers with reduced ground bounce and electromagnetic emission. ESSCIRC Bernd Deutschmann, Timm Ostermann
2003	—	`conf`	Characterization of the EME of integrated circuits with the help of the IEC standard 61967 [electromagnetic emission]. ETW Timm Ostermann, Bernd Deutschmann
2003	C	`conf`	Measures to Reduce the Electromagnetic Emission of a SoC. VLSI-SOC Timm Ostermann, Wolfgang Gut, Christian Bacher, Bernd Deutschmann
2003	—	`conf`	TEM-cell and surface scan to identify the electromagnetic emission of integrated circuits. ACM Great Lakes Symposium on VLSI Timm Ostermann, Bernd Deutschmann