Benjamin J. Fletcher

11 papers A 5C 1Journal 3Unranked 2
YearRankTypeTitle / Venue / Authors
2020 — conf
A 3D-Stacked Cortex-M0 SoC with 20.3Gbps/mm
VLSI Circuits
Benjamin J. Fletcher, Terrence S. T. Mak, Shidhartha Das
2020 J jnl
A Spike-Latency Transceiver With Tunable Pulse Control for Low-Energy Wireless 3-D Integration.
IEEE J. Solid State Circuits
Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak
2019 — conf
A 10.8pJ/bit Pulse-Position Inductive Transceiver for Low-Energy Wireless 3D Integration.
ESSCIRC
Benjamin J. Fletcher, Terrence S. T. Mak, Shidhartha Das
2019 A conf
A Low-Energy Inductive Transceiver using Spike-Latency Encoding for Wireless 3D Integration.
ISLPED
Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak
2019 A conf
CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs.
DATE
Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak
2019 J jnl
Design and Optimization of Inductive-Coupling Links for 3-D-ICs.
IEEE Trans. Very Large Scale Integr. Syst.
Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak
2019 J jnl
Momentum: Power-neutral Performance Scaling with Intrinsic MPPT for Energy Harvesting Computing Systems.
ACM Trans. Embed. Comput. Syst.
Domenico Balsamo, Benjamin J. Fletcher, Alex S. Weddell, Giorgos Karatziolas, Bashir M. Al-Hashimi, Geoff V. Merrett
2018 A conf
A high-speed design methodology for inductive coupling links in 3D-ICs.
DATE
Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak
2018 C conf
Globally Wireless Locally Wired (GloWiLoW): A Clock Distribution Network for Many-Core Systems.
ISCAS
Qian Ding, Benjamin J. Fletcher, Terrence S. T. Mak
2018 A conf
Low-power 3D integration using inductive coupling links for neurotechnology applications.
DATE
Benjamin J. Fletcher, Shidhartha Das, Chi-Sang Poon, Terrence S. T. Mak
2017 A conf
Power neutral performance scaling for energy harvesting MP-SoCs.
DATE
Benjamin J. Fletcher, Domenico Balsamo, Geoff V. Merrett