Baozhen Li

17 papers Journal 4Unranked 13
YearRankTypeTitle / Venue / Authors
2025 — conf
A Systematic Study of Temperature, Polarity, Thickness, and Ramp Rate Dependencies of Ramp-Voltage Stress for SiO2 and its Comparison with 2D Gate Dielectrics.
IRPS
Ernest Y. Wu, Richard G. Southwick, Baozhen Li
2023 — conf
Tomato leaf disease identification based on attention and inception mechanism.
AIPR
Guangyuan Zhao, Baozhen Li, Xu Huang
2022 — conf
A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation.
IRPS
Ernest Y. Wu, Ron Bolam, Baozhen Li, Tian Shen, Barry P. Linder, Griselda Bonilla, Miaomiao Wang, Dechao Guo
2022 — conf
Quantum Mechanical Connection of Schottky Emission Process and Its implications on Breakdown Methodology and Conduction Modeling for BEOL Low-k Dielectrics.
IRPS
Ernest Y. Wu, Baozhen Li
2019 — conf
Comprehensive Methodology for Multiple Spots Competing Progressive Breakdown for BEOL/FEOL Applications.
IRPS
Ernest Y. Wu, Baozhen Li, James H. Stathis, Andrew Kim
2019 — conf
Transformation of Ramped Current Stress VBDto Constant Voltage Stress TDDB TBD.
IRPS
Andrew Kim, Ernest Y. Wu, Baozhen Li, Barry P. Linder
2018 — conf
Elapsed-time statistics of successive breakdown in the presence of variability for dielectric breakdown in BEOL/MOL/FEOL applications.
IRPS
Ernest Y. Wu, Andrew Kim, Baozhen Li, James H. Stathis
2018 — conf
Electromigration characteristics of power grid like structures.
IRPS
Baozhen Li, Andrew Kim, Paul McLaughlin, Barry P. Linder, Cathryn Christiansen
2018 — conf
Transient self-heating modeling and simulations of back-end-of-line interconnects.
IRPS
Andrew Kim, Baozhen Li, Barry P. Linder
2015 — conf
A case study of electromigration reliability: From design point to system operations.
IRPS
Baozhen Li, K. Paul Muller, James D. Warnock, Leon J. Sigal, Dinesh Badami
2015 — conf
A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL).
IRPS
Ernest Y. Wu, James H. Stathis, Baozhen Li, Barry P. Linder, Kai Zhao, Griselda Bonilla
2014 J jnl
Electromigration challenges for advanced on-chip Cu interconnects.
Microelectron. Reliab.
Baozhen Li, Cathryn Christiansen, Dinesh Badami, Chih-Chao Yang
2008 — conf
Neural Network Approach Based on Agent to Predict Stock Performance.
CSSE (1)
Shengnan Xu, Baozhen Li, Yanhua Shao
2006 J jnl
Application of three-parameter lognormal distribution in EM data analysis.
Microelectron. Reliab.
Baozhen Li, Emmanuel Yashchin, Cathryn Christiansen, Jason Gill, Ronald Filippi, Timothy D. Sullivan
2004 J jnl
Reliability challenges for copper interconnects.
Microelectron. Reliab.
Baozhen Li, Timothy D. Sullivan, Tom C. Lee, Dinesh Badami
2004 — conf
Transformation & Countermeasures on Business Operation Models in Uncertain Environment.
ICEB
Baozhen Li, Nana Li, Xianfeng Liu
2002 J jnl
A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO
Microelectron. Reliab.
Fen Chen, Rolf-Peter Vollertsen, Baozhen Li, Dave Harmon, Wing L. Lai