| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
Microelectron. J.
|
| 2023 | J | jnl |
Int. J. Syst. Assur. Eng. Manag.
|
| 2021 | — | conf |
ICC Workshops
|
| 2021 | — | conf |
ISDCS
|
| 2021 | J | jnl |
IET Circuits Devices Syst.
|
| 2021 | — | conf |
ISQED
|
| 2020 | — | conf |
ISDCS
|
| 2020 | — | conf |
ISDCS
|
| 2020 | J | jnl |
IET Circuits Devices Syst.
|
| 2019 | J | jnl |
Expert Syst. Appl.
|
| 2019 | J | jnl |
J. Electronic Imaging
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
CoRR
|
| 2016 | J | jnl |
Microelectron. J.
|
| 2015 | — | conf |
VDAT
|
| 2014 | J | jnl |
Efficient ECSM Characterization Considering Voltage, Temperature, and Mechanical Stress Variability.
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2013 | — | conf |
ISQED
|
| 2012 | — | conf |
ISQED
|
| 2012 | — | conf |
RAIT
|
| 2011 | — | conf |
ISQED
|