| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | — | conf |
NCC
|
| 2025 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | Misc | conf |
ICASSP
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | C | conf |
TENCON
|
| 2024 | C | conf |
TENCON
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Vis. Comput.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
SPCOM
|
| 2022 | J | jnl |
Signal Process. Image Commun.
|
| 2021 | — | conf |
IC3D
|
| 2021 | J | jnl |
CoRR
|
| 2020 | — | conf |
SPCOM
|
| 2019 | J | jnl |
IEEE Trans. Image Process.
|
| 2018 | — | conf |
3DTV-Conference
|
| 2018 | B | conf |
QoMEX
|
| 2018 | J | jnl |
IEEE Signal Process. Lett.
|
| 2018 | B | conf |
ICIP
|
| 2017 | Misc | conf |
ICASSP
|
| 2017 | — | conf |
IC3D
|
| 2017 | J | jnl |
CoRR
|
| 2017 | — | conf |
SD&A
|
| 2016 | J | jnl |
Signal Process. Image Commun.
|
| 2016 | — | conf |
SPCOM
|
| 2016 | J | jnl |
CoRR
|
| 2016 | J | jnl |
Signal Process. Image Commun.
|
| 2015 | J | jnl |
IEEE Signal Process. Lett.
|