| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | — | conf |
BCD
|
| 2024 | — | conf |
IIAI-AAI
|
| 2023 | — | conf |
IIAI-AAI
|
| 2022 | — | conf |
IIAI-AAI
|
| 2022 | — | conf |
IIAI-AAI
|
| 2020 | — | conf |
UV
|
| 2019 | — | ed. |
BCD
|
| 2019 | — | conf |
BCD
|
| 2019 | — | conf |
IIAI-AAI
|
| 2019 | — | conf |
TALE
|
| 2018 | — | conf |
IIAI-AAI
|
| 2017 | — | conf |
IIAI-AAI
|
| 2016 | — | conf |
IIAI-AAI
|
| 2015 | — | conf |
IEEM
|
| 2009 | — | conf |
SOLI
|
| 2008 | — | conf |
BASYS
|
| 1998 | Misc | conf |
Thin Film Magnetic Head Wafer Inspection Technique Using Geometrical Feature Based Image Comparison.
MVA
|