Artur Wymyslowski

23 papers Journal 22Unranked 1
YearRankTypeTitle / Venue / Authors
2017 J jnl
Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Microelectron. Reliab.
Artur Wymyslowski
2016 J jnl
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Microelectron. Reliab.
Artur Wymyslowski
2015 J jnl
Adhesion work analysis through molecular modeling and wetting angle measurement.
Microelectron. Reliab.
Dawid Jan Król, Artur Wymyslowski, Kamil Nouri Allaf
2015 J jnl
Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Microelectron. Reliab.
Artur Wymyslowski
2014 J jnl
Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Microelectron. Reliab.
Artur Wymyslowski
2014 — conf
Improving co-design of smart sensor front-ends.
MIXDES
Ryszard Swierczynski, Krzysztof Urbanski, Artur Wymyslowski
2013 J jnl
Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials.
Microelectron. Reliab.
Artur Wymyslowski, Lukasz Dowhan
2013 J jnl
Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Microelectron. Reliab.
Artur Wymyslowski
2013 J jnl
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique.
Microelectron. Reliab.
Didier Chicot, K. Tilkin, K. Jankowski, Artur Wymyslowski
2012 J jnl
2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab.
Artur Wymyslowski
2012 J jnl
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging.
Microelectron. Reliab.
E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen
2011 J jnl
2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab.
Artur Wymyslowski
2011 J jnl
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods.
Microelectron. Reliab.
Lukasz Dowhan, Artur Wymyslowski, Pawel Janus, Magdalena Ekwinska, Olaf Wittler
2011 J jnl
Numerical prototyping methods in microsystem accelerometers design.
Microelectron. Reliab.
Lukasz Dowhan, Artur Wymyslowski, Stanislaw Kalicinski, Pawel Janus
2010 J jnl
Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab.
Artur Wymyslowski
2009 J jnl
Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab.
Artur Wymyslowski
2008 J jnl
An approach of numerical multi-objective optimization in stacked packaging.
Microelectron. Reliab.
Lukasz Dowhan, Artur Wymyslowski, Rainer Dudek
2008 J jnl
Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab.
Artur Wymyslowski
2007 J jnl
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.
Microelectron. Reliab.
Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
2007 J jnl
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach.
Microelectron. Reliab.
Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst
2007 J jnl
Numerical approach to characterization of thermally conductive adhesives.
Microelectron. Reliab.
Tomasz Falat, Artur Wymyslowski, Jana Kolbe
2007 J jnl
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab.
Artur Wymyslowski
2007 J jnl
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab.
Artur Wymyslowski, Bart Vandevelde, Dag Andersson