Armin Klumpp - RankMe

11 papers A 1Journal 1Unranked 9

Year	Rank	Type	Title / Venue / Authors
2024	—	`conf`	Superconducting Titanium Nitride in Through-Silicon Vias for 3D Integration of Qubits. 3DIC Alexandra Schewski, Ulrich Schaber, Armin Klumpp
2019	—	`conf`	A CMOS-Based Electrochemical DNA Hybridization Microarray for Diagnostic Applications with 109 Test Sites. BioCAS Norman Dodel, Roland Thewes, Anouar Laifi, Dirk Eberhardt, Stefan Keil, Leonhard Sturm, Armin Klumpp, Oliver Freudenberg, Friedel Gerfers, Gerhard Hartwich
2019	—	`conf`	Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. 3DIC Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt
2017	—	`conf`	Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism. IEEE SENSORS Rita Siris, Jamila Boudaden, Armin Klumpp
2016	—	`conf`	3D TSV based high frequency components for RF IC and RF MEMS applications. 3DIC Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati
2016	—	`conf`	Smart capacitive CO2 sensor. IEEE SENSORS Jamila Boudaden, Armin Klumpp, Ignaz Eisele, Christoph Kutter
2010	—	`conf`	3D Integration technology: Status and application development. ESSCIRC Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc
2010	A	`conf`	3D-integration of silicon devices: A key technology for sophisticated products. DATE Armin Klumpp, Peter Ramm, Robert Wieland
2010	—	`conf`	Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC. 3DIC Ladislav Andricek, Michael Beimforde, Armin Klumpp, Anna Macchiolo, Karl-Reinhard Merkel, Hans-Günther Moser, Richard Nisius, Rainer Helmut Richter, Josef Weber, Philipp Weigell, Robert Wieland
2010	—	`conf`	High performance 3D interconnects based on electrochemical etch and liquid metal fill. 3DIC Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm
2008	J	`jnl`	Technologies for 3D Heterogeneous Integration CoRR Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl