Andy Miller

18 papers Journal 4Unranked 14
YearRankTypeTitle / Venue / Authors
2024 — conf
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.
OFC
Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout
2024 J jnl
Do LLMs "know" internally when they follow instructions?
CoRR
Juyeon Heo, Christina Heinze-Deml, Oussama Elachqar, Shirley You Ren, Udhay Nallasamy, Andy Miller, Kwan Ho Ryan Chan, Jaya Narain
2024 — conf
Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects.
OFC
Pengfei Xu, Chiara Marchese, Guy Lepage, Negin Golshani, Ruben Van Eenaeme, Andrea Mingardi, Joost Van Ongeval, Rafal Magdziak, Luc Halipre, Darko Trivkovic, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Filippo Ferraro, Yoojin Ban, Joris Van Campenhout
2024 — conf
Process Development for a Novel Low Loss and Non-PFAS Photo Imageable Dielectric for RF Silicon Interposer Applications.
3DIC
Hamideh Jafarpoorchekab, Xiao Sun, Angel Uruena, Siddhartha Sinha, Nelson Pinho, Andy Miller, Nadine Collaert
2022 — conf
(Why do we need) Wireless Heterogeneous Integration (anyway?).
VLSI Technology and Circuits
Michaël Peeters, S. Sinha, Xiao Sun, Claude Desset, Giuseppe Gramegna, John Slabbekoorn, Pieter Bex, Nelson Pinho, Tomas Webers, Dimitrios Velenis, Andy Miller, Nadine Collaert, Geert Van der Plas, Eric Beyne, Martijn Huynen, R. Broucke
2019 — conf
Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
3DIC
Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
2018 — conf
Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.
OFC
Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, Andy Miller, Marianna Pantouvaki, Philippe Absil, Joris Van Campenhout
2018 — conf
Silicon Photonics for 56G NRZ Optical Interconnects.
OFC
Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil
2016 — conf
Die to wafer 3D stacking for below 10um pitch microbumps.
3DIC
Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller
2016 — conf
Extreme wafer thinning optimization for via-last applications.
3DIC
Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas
2016 — conf
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.
3DIC
Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann
2015 — conf
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.
3DIC
Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne, Chung-Sun Lee
2015 — conf
Processing active devices on Si interposer and impact on cost.
3DIC
Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne
2013 J jnl
Trees of integral triangles with given rectangular defect.
Discret. Math.
Andy Miller
2011 — conf
In-line metrology and inspection for process control during 3D stacking of IC's.
3DIC
Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne
2011 — conf
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
3DIC
Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne
2010 J jnl
Counting numerical sets with no small atoms.
J. Comb. Theory A
Jeremy Louis Marzuola, Andy Miller
1999 J jnl
Generating Functions for Actions on Handlebodies with Genus Zero Quotient.
J. Comb. Theory A
Matt Compton, Andy Miller